In-line process monitoring using surface charge analysis

A. Resnick, E. Kamieniecki, H. Phelps, Donald A. Jackson
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引用次数: 1

Abstract

The effect of pull temperature on oxide charge and interface trap density is explored using surface charge analysis (SCA). With this technique, lower pull temperatures were found to result in lower oxide charge and interface trap density levels. The impact of pull temperature on these parameters was found to exist even after a number of additional processing steps. SCA was used to evaluate the individual charge contribution of each step within a process sequence.<>
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使用表面电荷分析进行在线过程监控
利用表面电荷分析(SCA)探讨了拉温对氧化物电荷和界面陷阱密度的影响。使用这种技术,较低的拉伸温度可以降低氧化物电荷和界面陷阱密度水平。拉拔温度对这些参数的影响是存在的,即使经过一些额外的加工步骤。SCA用于评估过程序列中每个步骤的单个电荷贡献。
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