Fabrication of thick Pb(Zr,Ti)O3 (PZT) films by modified sol–gel methods for application in MEMS

J. Chu, Jian Lu, Wenhao Huang, Yan Yang
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引用次数: 5

Abstract

Pb(Zr,Ti)O 3 (PZT) films with thickness ranging from 2 μm to 10 μm have successfully been prepared using the sol-gel-based ceramic-ceramic 0-3 composite method, polyvinylpyrrolidone (PVP)-assisted sol-gel method and electrostatic spray deposition (ESD) with satisfied film properties on Pt/Ti/SiO 2 /Si substrate. Using PVP and PZT powders as additives, the critical thickness of sol-gel derived PZT film can be sufficiently increased to 0.9 μm and 0.5 μm, respectively. The crystal-orientation of the films was investigated by X-ray diffractometer. It was found that the use of buffer layer was effective to affect the film's nucleation and growth behavior and enhance the pervoskite (100) orientation. According to the atomic force microscope images, these films exhibit uniform grain size distribution. The relative dielectric constants of the film prepared by these modified sol-gel techniques, 1050, 600 and 960, were measured, which are satisfied for application in MEMS.
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溶胶-凝胶法制备MEMS用Pb(Zr,Ti)O3 (PZT)厚膜
采用溶胶-凝胶基陶瓷-陶瓷0-3复合方法、聚乙烯吡咯烷酮(PVP)辅助溶胶-凝胶法和静电喷涂法在Pt/Ti/ sio2 /Si衬底上成功制备了厚度为2 ~ 10 μm的Pb(Zr,Ti) o3 (PZT)薄膜,并获得了满意的薄膜性能。PVP和PZT粉末作为添加剂,可将PZT膜的临界厚度分别提高到0.9 μm和0.5 μm。用x射线衍射仪研究了薄膜的晶体取向。研究发现,缓冲层的使用可以有效地影响薄膜的成核和生长行为,并增强钙钛矿(100)的取向。从原子力显微镜图像看,这些薄膜的晶粒尺寸分布均匀。测定了溶胶-凝胶修饰膜的相对介电常数分别为1050、600和960,满足了在微机电系统中的应用。
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