S. Kobayashi, T. Kitano, K. Takeshita, S. Sugimoto, M. Akimoto
{"title":"Optimum drying method for scan coating","authors":"S. Kobayashi, T. Kitano, K. Takeshita, S. Sugimoto, M. Akimoto","doi":"10.1109/ISSM.2001.963000","DOIUrl":null,"url":null,"abstract":"This paper introduces the optimum drying technology after scan coating. For this method, we adopted decompression drying method and we found it an optimum method. This is the only method, which is compatible with better thickness profile (1.9%) and rapid throughput (145 sec). The important thing in the drying process is to volatilize solvent slowly and dry the volatilized thinner to make it form a laminar flow. The thickness profile of decompression drying method is not inferior to that of spin coating.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2001.963000","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper introduces the optimum drying technology after scan coating. For this method, we adopted decompression drying method and we found it an optimum method. This is the only method, which is compatible with better thickness profile (1.9%) and rapid throughput (145 sec). The important thing in the drying process is to volatilize solvent slowly and dry the volatilized thinner to make it form a laminar flow. The thickness profile of decompression drying method is not inferior to that of spin coating.
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