Multi-level switching of triple-layered TaOx RRAM with excellent reliability for storage class memory

Seung Ryul Lee, Young-Bae Kim, Man Chang, K. Kim, Chang Bum Lee, J. Hur, G. Park, Dongsoo Lee, Myoung-Jae Lee, C. J. Kim, U. Chung, I. Yoo, Kinam Kim
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引用次数: 147

Abstract

A highly reliable RRAM with multi-level cell (MLC) characteristics were fabricated using a triple-layer structure (base layer/oxygen exchange layer/barrier layer) for the storage class memory applications. A reproducible multi-level switching behaviour was successfully observed, and simulated by the modulated Schottky barrier model. Morevoer, a new programming algorithm was developed for more reliable and uniform MLC operation. As a result, more than 107 cycles of switching endurance and 10 years of data retention at 85°C for all the 2 bit/cell operation were archieved.
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三层TaOx RRAM的多级开关,具有优异的可靠性,用于存储级存储器
采用三层结构(基层/氧交换层/阻挡层)制备了一种具有多单元(MLC)特性的高可靠性RRAM,用于存储级存储应用。成功地观察到可再现的多级开关行为,并通过调制肖特基势垒模型进行了模拟。为了使MLC运行更加可靠和均匀,提出了一种新的编程算法。因此,在85°C下,所有2位/单元操作的切换续航时间超过107次,数据保留时间超过10年。
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