The realities of ASIC packaging

Third Annual IEEE Proceedings on ASIC Seminar and Exhibit Pub Date : 1990-09-17 DOI:10.1109/ASIC.1990.186082

T. Wong

引用次数: 0

Abstract

Summary form only given, as follows. ASIC is the technology driver for advanced packaging. This includes high-pin-count surface mount devices, high-performance ceramic packages, tape automated bonding (TAB) packages, and multichip modules (MCM). Emphasis is placed on fine-pitch technology (FPT) and the advantages and limitations of quad flat packs (QFP). Limitations due to power dissipation, ability to handle large die sizes, pin pitch below 0.4 mm, and coplanarity issues are addressed. Future trends in ASIC packaging are covered. A short introduction to multichip modules is also presented.<>

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ASIC封装的现实

仅给出摘要形式，如下。ASIC是先进封装的技术驱动力。这包括高引脚数表面贴装器件、高性能陶瓷封装、胶带自动粘合(TAB)封装和多芯片模块(MCM)。重点放在了细间距技术(FPT)和四平面封装(QFP)的优势和局限性。解决了功耗、处理大尺寸模具的能力、引脚间距低于0.4 mm以及共平面问题等方面的限制。介绍了ASIC封装的未来趋势。本文还简要介绍了多芯片模块。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Third Annual IEEE Proceedings on ASIC Seminar and Exhibit

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