A new junction technology for low-resistance contacts and Schottky barrier MOSFETs

D. Grupp, D. Connelly, C. Faulkner, P. Clifton
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Abstract

By imposing an ultra-thin insulator between low-workfunction metals and silicon, the Schottky barrier of the junction can be substantially reduced, reducing junction resistance. With this approach, low Schottky barrier metal S/D MOSFETs with Mg and Yb as S/D metals are demonstrated.
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一种用于低阻触点和肖特基势垒mosfet的新结技术
通过在低功功能金属和硅之间施加超薄绝缘体,结的肖特基势垒可以大大降低,从而降低结电阻。利用这种方法,展示了以Mg和Yb为S/D金属的低肖特基势垒金属S/D mosfet。
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