Vibration durability of board mounted BallGridArrays

Abstract

The reliability of electrical components and their solder joints in particular, with respect to vibration, also often referred to as high cycle fatigue, becomes more and more important to customers in the automotive industry. The industry increasingly requires a guaranteed life time of the solder joints considering a defined vibration load by means of modeling and simulation due to shorter time to market cycles for electronic control units and therefore less allowance for failure during product qualification. The paper presents an accepted and efficient procedure to calculate the solder joint life time, considering a given random vibration profile for a MAPBGA and discusses its possibilities and limits. A stress-life durability model is used to estimate the reliability of board level assemblies. It is based on a combination of Basquin's law for high cycle fatigue (HCF) and Coffin-Manson law for low cycle fatigue.