Prediction of GaAs MESFET process-induced variations using a device-physics-based analytical model

K. Shih, D. Klemer, J. Liou
{"title":"Prediction of GaAs MESFET process-induced variations using a device-physics-based analytical model","authors":"K. Shih, D. Klemer, J. Liou","doi":"10.1109/SOUTHC.1994.498109","DOIUrl":null,"url":null,"abstract":"This paper presents results of the use of a device-physics-based MESFET analysis code to predict the effects of process-induced variations on MESFET parameters. Such an approach is useful for predicting device yields and sensitivities of device parameters to variations in device fabrication processes such as gate recess depth and device dimensions. Our simulation is general in the sense that it can allow for arbitrary doping profiles and velocity-field characteristics.","PeriodicalId":164672,"journal":{"name":"Conference Record Southcon","volume":"834 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record Southcon","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOUTHC.1994.498109","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

This paper presents results of the use of a device-physics-based MESFET analysis code to predict the effects of process-induced variations on MESFET parameters. Such an approach is useful for predicting device yields and sensitivities of device parameters to variations in device fabrication processes such as gate recess depth and device dimensions. Our simulation is general in the sense that it can allow for arbitrary doping profiles and velocity-field characteristics.
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利用基于器件物理的分析模型预测GaAs MESFET过程引起的变化
本文介绍了使用基于器件物理的MESFET分析代码来预测过程引起的MESFET参数变化的影响的结果。这种方法对于预测器件产量和器件参数对器件制造工艺(如栅极凹槽深度和器件尺寸)变化的敏感性是有用的。我们的模拟是通用的,因为它可以允许任意的掺杂分布和速度场特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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