{"title":"Re-targetting manufacturing technologies in multichip module layout","authors":"S. Tasker","doi":"10.1109/ASIC.1990.186199","DOIUrl":null,"url":null,"abstract":"The author describes how a multichip module (MCM) may be retargeted from one manufacturing technology to another during the physical layout. Some of the differences in manufacturing techniques of the MCM-C, MCM-L, and MCM-D and the effects that they have on the layout task are discussed. MCM-L uses a laminated circuit board process, MCM-C is a cofired ceramic process, and MCM-D is similar to an IC manufacturing process in which conductive material is deposited on to a silicon substrate. The system consists of both design and analysis tools. Automatic routing up to 48 signal layers and electrical analysis for reflections, crosstalk, and simple thermal analysis are described.<<ETX>>","PeriodicalId":126693,"journal":{"name":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-09-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Third Annual IEEE Proceedings on ASIC Seminar and Exhibit","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASIC.1990.186199","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The author describes how a multichip module (MCM) may be retargeted from one manufacturing technology to another during the physical layout. Some of the differences in manufacturing techniques of the MCM-C, MCM-L, and MCM-D and the effects that they have on the layout task are discussed. MCM-L uses a laminated circuit board process, MCM-C is a cofired ceramic process, and MCM-D is similar to an IC manufacturing process in which conductive material is deposited on to a silicon substrate. The system consists of both design and analysis tools. Automatic routing up to 48 signal layers and electrical analysis for reflections, crosstalk, and simple thermal analysis are described.<>
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