Machine Learning Approaches for Nuisance filtering in Inline Defect Inspection

Sanghyun Lee, Ankit Jain, M. Plihal, S. Paramasivam, Tai-Kam Ng, Erfan Soltanmohammadi, Ian Tolle, D. Salvador
{"title":"Machine Learning Approaches for Nuisance filtering in Inline Defect Inspection","authors":"Sanghyun Lee, Ankit Jain, M. Plihal, S. Paramasivam, Tai-Kam Ng, Erfan Soltanmohammadi, Ian Tolle, D. Salvador","doi":"10.1109/ASMC.2019.8791805","DOIUrl":null,"url":null,"abstract":"Broadband plasma (BBP) optical defect inspection systems are widely used for process monitoring. The outputs of inspection include the defects of interest (DOI) for that process step. It is important to not only detect the DOI, but also to separate them from other types of defects that are non- relevant to the process itself, i.e., nuisance defects. The process of separating DOI from nuisance is called nuisance filtering [1], [2]. Typical nuisance filtering algorithms used on BBP systems are user-created decision trees leveraging defect attributes assigned during inspection. As design nodes shrink and pattern density increases, nuisance filtering is becoming more difficult, leading to increased recipe setup time. Further, due to the increased complexity of the decision trees, user to user variation can affect inspection performance. To solve this problem, an innovative nuisance filtering algorithm is required. The key elements for such an algorithm are consistency and improved performance compared to user-created decision trees. This paper compares traditional decision trees as well as novel machine learning approaches for nuisance filtering in inline defect inspection tools, named inLine Defect Organizer™ 2.0 (iDO™ 2.0). The study achieved improvements in increased DOI capture rate, reduced nuisance defects and faster recipe setup time.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"94 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791805","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Broadband plasma (BBP) optical defect inspection systems are widely used for process monitoring. The outputs of inspection include the defects of interest (DOI) for that process step. It is important to not only detect the DOI, but also to separate them from other types of defects that are non- relevant to the process itself, i.e., nuisance defects. The process of separating DOI from nuisance is called nuisance filtering [1], [2]. Typical nuisance filtering algorithms used on BBP systems are user-created decision trees leveraging defect attributes assigned during inspection. As design nodes shrink and pattern density increases, nuisance filtering is becoming more difficult, leading to increased recipe setup time. Further, due to the increased complexity of the decision trees, user to user variation can affect inspection performance. To solve this problem, an innovative nuisance filtering algorithm is required. The key elements for such an algorithm are consistency and improved performance compared to user-created decision trees. This paper compares traditional decision trees as well as novel machine learning approaches for nuisance filtering in inline defect inspection tools, named inLine Defect Organizer™ 2.0 (iDO™ 2.0). The study achieved improvements in increased DOI capture rate, reduced nuisance defects and faster recipe setup time.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
内联缺陷检测中有害过滤的机器学习方法
宽带等离子体(BBP)光学缺陷检测系统广泛应用于过程监控。检查的输出包括该流程步骤的相关缺陷(DOI)。重要的是不仅要检测DOI,而且要将它们从与过程本身无关的其他类型的缺陷中分离出来,例如,讨厌的缺陷。将DOI与滋扰分离的过程称为滋扰过滤[1],[2]。在BBP系统上使用的典型有害过滤算法是用户创建的决策树,利用在检查期间分配的缺陷属性。随着设计节点的缩小和模式密度的增加,有害过滤变得越来越困难,从而增加了配方设置时间。此外,由于决策树的复杂性增加,用户之间的差异会影响检测性能。为了解决这一问题,需要一种创新的滋扰过滤算法。与用户创建的决策树相比,这种算法的关键要素是一致性和改进的性能。本文比较了内联缺陷检查工具(称为内联缺陷组织者™2.0 (iDO™2.0))中用于有害过滤的传统决策树和新型机器学习方法。该研究在提高DOI捕获率,减少有害缺陷和加快配方设置时间方面取得了改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Fast and accurate defect classification for CMP process monitoring A Deep Learning Model for Identification of Defect Patterns in Semiconductor Wafer Map The Etching of Silicon Nitride in Phosphoric Acid with Novel Single Wafer Processor Methods for RFSOI Damascene Tungsten Contact Etching Using High-Speed Video Analysis for Defect Investigation and Process Improvement
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1