{"title":"Adjacent line coupling for long off chip interconnects","authors":"H. Harrer, D. Kaller, E. Klink","doi":"10.1109/EPEP.1997.634057","DOIUrl":null,"url":null,"abstract":"The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.","PeriodicalId":220951,"journal":{"name":"Electrical Performance of Electronic Packaging","volume":"241 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.1997.634057","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The paper describes the coupling effects from adjacent lines for different types of material. The impact of high frequency effects will be shown for long board lines, which reduces the coupling noise. A typical off chip net structure of an S/390 computer system is examined and the attenuation effect is discussed for frequency dependent model parameters of the R, L and G values. Also the importance of the signal to power ratio for via structures and connectors will be demonstrated for several examples. Multiple cycle impacts are shown if reflections of the active signals coincide with the subsequent cycle. Finally, a comparison of the timing impact is given for thinfilm, standard ceramic, glass ceramic and FR4 board lines.