Perspectives in Component Failure Analysis

Abstract

Charles H. Sie Xerox Corp. 701 S. Aviation Blvd. El Segundo, Ca. 90245 With the development of radio, television, computers and microelectronics, electronic technology has rapidly evolved into a catalytic force in *sustaining industrial growth. As the electronic industry matures, product manufacturing cost and product quality are becoming determining factors for the product's competitiveness. The relationship between manufacturing cost and quality can either be a direct one (increased cost for higher quality) or an inverse one (decreased cost for. *higher quality) very much dependent upon the strategy chosen-to improve the product's quality. By increasing the stringency of the screening process,and therefore the cost, in the manufacturing flow, the product quality can be enhanced. However, the same result can be achieved in a.cost-. effective manner. if corrective action i's developed .based on the analysis of components failing in the screening process, shown schematically in Figure 1. The inverse cost-quality relationship comes about when i.mplementing corrective action, the screening rejection in the manufacturing flow and failure i-n the fie.ld will be reduced; therefore, correspondingly the manufacturing cost will be lowered and the quality improved. Usuallythe burden of component failure analysis and cor-rective action'development can be leveraged by the product volume or generically amortized across product lines. Component failure can truly be caused by an intermittent or. degraded component, or it can' be the symptom of a problem-which relates to circuit compatibility, to test coverage, or to manufacturing process. It is absolutely essential to uncover the real cause of the failure as evidenced by the responsiveness of the implemented corrective action; therefore, failure analysis should always be 'a closed loop activity. The effectiveness of the-failure analysis group can be greatly enhanced when its staff is multi-disciplinary including device physics, circuit des-ign and testing. Lastly, a highly focused component failure analysis activity will serve as a focal point for accountability, specially in a large organization. FIGURE 1. ROIL OF FAI URE ANALYSIS IN CLOSED LOOP ENGINFERING