High-Performance GaN Vertical Trench MOSFETs Grown on Si Substrate

Renqiang Zhu, Huaxing Jiang, C. Tang, K. Lau
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Abstract

In this work, we report high-performance GaN quasi-vertical trench MOSFETs grown on cost-effective 6-inch Si substrates. The fabricated GaN trench MOSFETs on Si, with a 2-μm drift layer, show a low specific ON-resistance (RON,sp) of 0.89 mΩ·cm2, a high maximum drain current (ID,max) of 4.1 kA/cm2, a large Vth of 5.1 V and a breakdown voltage (VBR) of 320 V, resulting from the combination of epilayer growth condition tuning and proper electric field management in the device.
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硅衬底上生长的高性能GaN垂直沟槽mosfet
在这项工作中,我们报告了在具有成本效益的6英寸Si衬底上生长的高性能GaN准垂直沟槽mosfet。在2 μm漂移层的硅基上制备的GaN沟槽mosfet具有低比导通电阻(RON,sp) 0.89 mΩ·cm2,最大漏极电流(ID,max)为4.1 kA/cm2, Vth为5.1 V,击穿电压(VBR)为320 V。
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