{"title":"Micro systems for sustainable society","authors":"M. Esashi","doi":"10.1109/IMFEDK.2014.6867043","DOIUrl":null,"url":null,"abstract":"Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor, electron source and other value-added devices.","PeriodicalId":202416,"journal":{"name":"2014 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMFEDK.2014.6867043","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor, electron source and other value-added devices.
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