Characteristics of CMOSFETs with sputter-deposited W/TiN stack gate

D. Lee, S. Joo, G. Lee, J. Moon, T. Shim, J. lee
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引用次数: 5

Abstract

W/TiN stack gate has been investigated as a new gate electrode in ULSI CMOSFETs. With the combination of low resistivity of W and Si-midgap workfunction of TiN, very low sheet resistance and the proper characteristics of both types of transistors could be obtained simultaneously. With the deposition of TiN film at high substrate temperature, the breakdown characteristics of gate oxide could be improved considerably. The proper condition of dry etching on this structure has been also obtained.
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溅射沉积W/TiN堆叠栅cmosfet的特性
研究了W/TiN叠层栅极作为ULSI cmosfet中的一种新型栅极。结合W的低电阻率和TiN的si中隙功函数,可以同时获得极低的片阻和两种晶体管的适当特性。在较高的衬底温度下沉积TiN薄膜,可以显著改善栅极氧化物的击穿特性。得到了在该结构上干刻蚀的适宜条件。
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Semiconductor CIM system, innovation toward the year 2000 CVD SiN/sub X/ anti-reflective coating for sub-0.5 /spl mu/m lithography Advantage of small geometry silicon MOSFETs for high-frequency analog applications under low power supply voltage of 0.5 V The influence of oxygen at epitaxial Si/Si substrate interface for 0.1 /spl mu/m epitaxial Si channel N-MOSFETs grown by UHV-CVD High-current, small parasitic capacitance MOS FET on a poly-Si interlayered (PSI: /spl Psi/) SOI wafer
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