Vertical Gate-All-Around Tunnel FETs Using InGaAs Nanowire/Si with Core-Multishell Structure

K. Tomioka, H. Gamo, J. Motohisa, T. Fukui
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引用次数: 2

Abstract

We present vertical gate-all-around (VGAA) tunnel FETs (TFETs) using InGaAs nanowire (NW)/Si heterojunction with modulation doped core-multishell NW structures. The NW/Si heterojunction was composed of the axial n+-InGaAs/intrinsic InGaAs NW/p-Si. We investigated effect of using modulation-doped InGaAs/InP/InAlAs/InP core-multishell NW structure for switching performance and showed current enhancement with a steep subthreshold slope (SS). The device exhibited a minimum SS of 21 mV/decade. In addition, the device showed high transconductance efficiency of around 520/V, which exceeded the theoretical maximum limit for conventional FETs (38.5/V). And we demonstrated p-channel switching behavior while maintaining steep SS with same architecture.
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基于InGaAs纳米线/硅的垂直栅-全隧道场效应管
我们利用InGaAs纳米线(NW)/Si异质结和调制掺杂核-多壳NW结构,提出了垂直栅极全能(VGAA)隧道场效应管(tfet)。NW/Si异质结由轴向n+-InGaAs/本征InGaAs NW/p-Si组成。我们研究了使用调制掺杂的InGaAs/InP/InAlAs/InP核心-多壳NW结构对开关性能的影响,并显示出陡峭的阈下斜率(SS)的电流增强。该器件的最小SS为21 mV/ 10年。此外,该器件的跨导效率高达520/V左右,超过了传统fet的理论最大值(38.5/V)。我们演示了p通道切换行为,同时保持相同结构的陡SS。
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