An electrical test structure to evaluate linewidth variations due to proximity effects in optical lithography

M. Fallon, J. Stevenson, A. Walton, A. Gundlach
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引用次数: 1

Abstract

A simple test structure is used in the investigation of linewidth variation at topographical edges. Preliminary qualititative results for electrical linewidth variations are presented and correlated with SEM inspection. A linewidth reduction is observed as the two features on different layers draw closer together and it is demonstrated that this approach is sensitive enough to enable lithography engineers to optimise resist processing to minimise this effect.
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一种用于评估光刻中由于接近效应而引起的线宽变化的电气测试结构
在地形边缘线宽变化的研究中,采用了一种简单的测试结构。给出了电线宽变化的初步定性结果,并与SEM检测相关联。当不同层上的两个特征靠近在一起时,可以观察到线宽减少,并且证明这种方法足够敏感,使光刻工程师能够优化抗蚀剂处理以最大限度地减少这种影响。
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