Preliminary Study on Segmentation of Printed Wiring Board Images by use of Standard Deviation Filter and SVM

Shogo Eda, H. Takizawa
{"title":"Preliminary Study on Segmentation of Printed Wiring Board Images by use of Standard Deviation Filter and SVM","authors":"Shogo Eda, H. Takizawa","doi":"10.23919/ICEP55381.2022.9795430","DOIUrl":null,"url":null,"abstract":"It is necessary to detect defect parts on printed wiring boards (PWBs). This paper proposes a segmentation method of PWB images by use of a standard deviation filter and patch-based support vector machine. The proposed method was applied to actual PWB images, and several results were shown.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795430","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

It is necessary to detect defect parts on printed wiring boards (PWBs). This paper proposes a segmentation method of PWB images by use of a standard deviation filter and patch-based support vector machine. The proposed method was applied to actual PWB images, and several results were shown.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于标准差滤波和支持向量机的印制板图像分割的初步研究
对印刷线路板上的缺陷部件进行检测是必要的。本文提出了一种基于标准偏差滤波和基于patch的支持向量机的PWB图像分割方法。将该方法应用于实际的PWB图像,得到了一些结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Strain-Induced Change in the Photonic Properties of Dumbbell-Shaped Graphene Nanoribbon Structures Terminal Reaction Behaviors in Micro Bumps: Comparison of Ti and Cr Adhesion Layers Low temperature interconnects in 1st level packaging and its challenges Advanced Low Dk and High-Density Photo- Imageable Dielectrics for RDL Interposer Low-Temperature Chemical Vapor Deposition of SiCN for Hybrid Bonding
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1