Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s

C. Karnfelt, J. Hallin, T. Kjellberg, B. Hansson, T. Swahn
{"title":"Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s","authors":"C. Karnfelt, J. Hallin, T. Kjellberg, B. Hansson, T. Swahn","doi":"10.1109/EUMC.2007.4405395","DOIUrl":null,"url":null,"abstract":"Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of -3.5 V and consumes 2.1 W.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"876 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 European Microwave Integrated Circuit Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMC.2007.4405395","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of -3.5 V and consumes 2.1 W.
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采用InP DHBT技术的倒装1:4解复用集成电路,运行速度高达100gb /s
介绍了一种采用InP DHBT技术的封装1:4解复用器(DEMUX),其输入数据速率高达100gb /s。DEMUX IC采用倒装芯片安装在微波封装中,该封装由氮化铝衬底组成,共面波导放置在带有同轴v型连接器的Kovar/MoCu外壳中。DEMUX在-3.5 V的电源电压下工作,功耗为2.1 W。
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