A versatile monolithic RF amplifier using a dielectrically isolated monolithic microwave integrated circuit (DIMMIC)

P. Bachert, M. McCombs, P. Sanders
{"title":"A versatile monolithic RF amplifier using a dielectrically isolated monolithic microwave integrated circuit (DIMMIC)","authors":"P. Bachert, M. McCombs, P. Sanders","doi":"10.1109/BIPOL.1988.51090","DOIUrl":null,"url":null,"abstract":"A new RF integrated-circuit technology is described that overcomes the drawbacks of currently available integrated processes. This DIMMIC technology draws its advantage from its dielectric isolation, which minimizes parasitic substrate capacitance, and from its lack of increased collector resistance. Using this technology, a medium-power RF amplifier was built that reduced parts count and size significantly over its discrete counterpart without sacrificing performance.<<ETX>>","PeriodicalId":302949,"journal":{"name":"Proceedings of the 1988 Bipolar Circuits and Technology Meeting,","volume":"50 ","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 1988 Bipolar Circuits and Technology Meeting,","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BIPOL.1988.51090","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

A new RF integrated-circuit technology is described that overcomes the drawbacks of currently available integrated processes. This DIMMIC technology draws its advantage from its dielectric isolation, which minimizes parasitic substrate capacitance, and from its lack of increased collector resistance. Using this technology, a medium-power RF amplifier was built that reduced parts count and size significantly over its discrete counterpart without sacrificing performance.<>
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采用介质隔离单片微波集成电路(DIMMIC)的通用单片射频放大器
介绍了一种新的射频集成电路技术,克服了现有集成工艺的缺点。这种DIMMIC技术的优势在于它的介电隔离,可以最大限度地减少寄生衬底电容,并且没有增加集电极电阻。使用这种技术,一个中等功率的射频放大器,在不牺牲性能的情况下,大大减少了分立器件的数量和尺寸
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