{"title":"Fast characterization of hybrid near-field coupling effects of multi-PCBs in rectangular cavities with FFT-accelerated integral-equation method","authors":"Kai Yang, C. Ning, W. Yin","doi":"10.1109/EDAPS.2016.7893156","DOIUrl":null,"url":null,"abstract":"This paper analyzes the frequency-domain EMC/EMI problems including complicated transmission lines and printed circuit boards (PCBs) that reside in metallic rectangular cavities, by using an efficient iterative Fast Fourier Transform (FFT)-accelerated integral-equation method. The internal field distribution and near-field coupling/interference of multiple transmission-lines and PCBs in cavities can be extensively investigated with this method, which further enables the optimization of EMC/EMI design to effectively suppress near-field coupling effects for complicated multi-PCBs and transmission lines.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"154 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7893156","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper analyzes the frequency-domain EMC/EMI problems including complicated transmission lines and printed circuit boards (PCBs) that reside in metallic rectangular cavities, by using an efficient iterative Fast Fourier Transform (FFT)-accelerated integral-equation method. The internal field distribution and near-field coupling/interference of multiple transmission-lines and PCBs in cavities can be extensively investigated with this method, which further enables the optimization of EMC/EMI design to effectively suppress near-field coupling effects for complicated multi-PCBs and transmission lines.
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