Random rough surface effects in interconnects studied by small perturbation theory in waveguide model

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems Pub Date : 2011-12-12 DOI:10.1109/EPEPS.2011.6100215

R. Ding, L. Tsang, H. Braunisch

{"title":"Random rough surface effects in interconnects studied by small perturbation theory in waveguide model","authors":"R. Ding, L. Tsang, H. Braunisch","doi":"10.1109/EPEPS.2011.6100215","DOIUrl":null,"url":null,"abstract":"We study the effects of random roughness on wave propagation in a parallel plate metallic waveguide with finite conductivity. The rough surface is three dimensional (3D) with roughness heights varying in both horizontal directions. Integral equations are obtained from the extinction theorem formulated with layered medium Green's function. The second order small perturbation method is then applied to solve the integral equations. A closed form expression for the coherent wave is derived, which is expressed in terms of a three-fold Sommerfeld type integral due to the waveguide structure. Approximate methods are applied to calculate the Sommerfeld integral. The coherent wave enhancement factors of absorption are computed. The results for waveguides are also compared with the results obtained for a plane wave incident on a metal surface with 3D roughness. Results are illustrated for 3D roughness with a variety of power spectra. It is shown that enhancement factors for a waveguide are larger than that of the plane wave case.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

Abstract

We study the effects of random roughness on wave propagation in a parallel plate metallic waveguide with finite conductivity. The rough surface is three dimensional (3D) with roughness heights varying in both horizontal directions. Integral equations are obtained from the extinction theorem formulated with layered medium Green's function. The second order small perturbation method is then applied to solve the integral equations. A closed form expression for the coherent wave is derived, which is expressed in terms of a three-fold Sommerfeld type integral due to the waveguide structure. Approximate methods are applied to calculate the Sommerfeld integral. The coherent wave enhancement factors of absorption are computed. The results for waveguides are also compared with the results obtained for a plane wave incident on a metal surface with 3D roughness. Results are illustrated for 3D roughness with a variety of power spectra. It is shown that enhancement factors for a waveguide are larger than that of the plane wave case.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

用波导模型中的小微扰理论研究互连中的随机粗糙表面效应

研究了随机粗糙度对有限电导率平行板金属波导中波传播的影响。粗糙表面是三维的(3D)，粗糙度高度在两个水平方向上变化。用分层介质格林函数表示消光定理，得到积分方程。然后采用二阶小摄动法求解积分方程。导出了相干波的封闭表达式，由于波导结构的关系，该表达式用三重索默菲尔德型积分表示。采用近似方法计算了索默菲尔德积分。计算了吸收相干波的增强系数。将波导的结果与入射到具有三维粗糙度的金属表面的平面波的结果进行了比较。结果说明了三维粗糙度与各种功率谱。结果表明，波导的增强因子大于平面波情况下的增强因子。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems

自引率

0.00%

发文量

期刊最新文献

Simulations of pulse signals with X-parameters Extraction of jitter parameters from BER measurements Full-wave PEEC time domain solver based on leapfrog scheme Bended differential transmission line using short-circuited coupled line for common-mode noise suppression Deriving voltage tolerance specification for processor circuit design