Coherence Analysis of Wafer Process Measurements from Chamber and Optical Emission Spectrum : APC: Advanced Process Control

T. Ning, CH Huang, V. Wong, J. Jensen, H. Chan
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引用次数: 1

Abstract

Coherency analysis is adopted in this paper to examine the linear dependence between measurements of three processing parameters during wafer fabrication process. They are power, pressure and voltage measurements and three channels from optical emission spectrum data. The measurement data were divided into consecutive short data segments to provide time-stamped coherence signatures. Our results observe significant linear dependence appeared in multiple harmonic frequencies. The linear dependence appears in the beginning of the processing step and continues toward the end. The verified linear relationship between process parameters sheds the light for redundancy reduction and more compact data representation.
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从腔室和光学发射光谱测量晶圆过程的相干性分析:APC:先进的过程控制
本文采用相干分析的方法研究了晶圆制造过程中三个工艺参数测量值之间的线性关系。它们是功率、压力和电压测量以及三个通道的光发射光谱数据。测量数据被分成连续的短数据段,以提供带有时间戳的相干特征。我们的结果观察到在多个谐波频率中出现显著的线性相关性。线性相关性出现在处理步骤的开始,并一直持续到最后。经过验证的过程参数之间的线性关系为减少冗余和更紧凑的数据表示提供了线索。
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