IBM ARPA ASEM foundry

Y.-M. Ting
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Abstract

Summary form only given, as follows. IBM Federal Systems Company, as a prime contractor, has been awarded a $9.5 Million contract by the Advanced Research Projects Agency (ARPA), entitled "Low Volume Access to High Volume Production". The objectives of the contract are the development of a design system that allows customers to enter their design into the IBM Technology Products' Foundry in Hopewell Junction, New York, at various design stages, hybrid chip interconnection technology on a single substrate, participation in the development of industry standards for both known-good-die and the CAD Framework Initiative, and to fabricate, assemble and test multichip modules (MCMs) for use in commercial and military products. The final objective of this contract is to show an order of magnitude reduction in netlist to prototype turn-around-time and non-recurring engineering costs which are consistent with the ARPA ASEM Project goals.<>
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IBM ARPA ASEM 代工厂
仅给出摘要形式,如下。IBM联邦系统公司作为主承包商,被高级研究计划局(ARPA)授予了一份价值950万美元的合同,名为“小批量进入大批量生产”。该合同的目标是开发一个设计系统,允许客户在不同的设计阶段将他们的设计输入IBM技术产品在纽约Hopewell Junction的铸造厂,在单一基板上混合芯片互连技术,参与开发已知好的模具和CAD框架倡议的行业标准,并制造,组装和测试用于商业和军事产品的多芯片模块(mcm)。该合同的最终目标是显示网络列表到原型的周转时间和非重复性工程成本的数量级减少,这与ARPA ASEM项目的目标一致。
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