Finite element modelling of influence of bonding material distribution in precision piezoresistive MEMS pressure-sensors

Åsmund Sandvand, E. Halvorsen, K. Aasmundtveit
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引用次数: 2

Abstract

A MEMS pressure-sensor, including its vacuum reference cavity, is modelled with focus on resulting stress from a glass frit bonding process. Based on CT-scans of bonded samples, a parametric model for FEM analysis of observed variations in bonding material distribution has been developed. Simulations show a high influence of amount and distribution of excess glass frit material on the zero-point as well as a good correlation with manufacturing data. Simulated variations of glass frit material distribution shows a variation of the zero-point of -1.5 % full scale (FS) to -7.2 %FS, depending on configuration.
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精密压阻式MEMS压力传感器中键合材料分布影响的有限元建模
本文对MEMS压力传感器及其真空参考腔进行了建模,重点研究了玻璃熔块粘合过程中产生的应力。基于对粘结试样的ct扫描,建立了一种参数化模型,对观察到的粘结材料分布变化进行有限元分析。模拟结果表明,过量玻璃熔块材料的数量和分布对零点有很大的影响,并且与制造数据有很好的相关性。玻璃熔块材料分布的模拟变化表明,根据结构的不同,零点的变化范围为- 1.5%满量程(FS)到- 7.2% FS。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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