{"title":"InP-to-Si wafer heterobonding for optical MEMs","authors":"D. Pasquariello, M. Camacho, K. Hjort","doi":"10.1109/OMEMS.2000.879625","DOIUrl":null,"url":null,"abstract":"Summary form only given. We evaluate hydrophilic and hydrophobic surface pre-treatments in InP-to-Si direct wafer bonding. Surface roughness and surface chemistry was examined using atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). After bonding, the bonded interfaces were evaluated using infrared transmission imaging, bond-strength and current-voltage (I-V) measurements.","PeriodicalId":148819,"journal":{"name":"2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-08-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 IEEE/LEOS International Conference on Optical MEMS (Cat. No.00EX399)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMEMS.2000.879625","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Summary form only given. We evaluate hydrophilic and hydrophobic surface pre-treatments in InP-to-Si direct wafer bonding. Surface roughness and surface chemistry was examined using atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). After bonding, the bonded interfaces were evaluated using infrared transmission imaging, bond-strength and current-voltage (I-V) measurements.
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