Integration of diamond-like carbon and AlN for acoustic wave devices

Abstract

The integration of diamond-like carbon (DLC) and piezoelectric AlN thin film for acoustic wave devices has been presented. Provided the high acoustic velocity and high thermal conductivity of DLC, the AlN/DLC/Si layered structure will outperform the traditional AlN/Si structure for acoustic wave devices. In this paper, the key issues including the deposition of DLC and AlN for implementing DLC based acoustic wave device have been experimentally investigated and surface acoustic wave resonators have been fabricated based on the AlN/DLC/Si layered structure.