Anti-plane analysis of a crack terminating at interface of the isotropic half-planes bonded to intact orthotropic layers

IF 1.4 4区 工程技术 Q3 ENGINEERING, MECHANICAL Journal of Strain Analysis for Engineering Design Pub Date : 2023-11-07 DOI:10.1177/03093247231206322
Jaber Sadeghi, Jalil Pourmohammadi Vafa, Shahriar Fariborz
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Abstract

The analysis of a cracked isotropic half-plane perfectly bonded to an intact orthotropic layer is accomplished. A crack tip terminates at or is adjacent to the interface of the orthotropic layer and substrate while sustaining anti-plane traction. The power of stress singularity at the crack tip, situated in the interface, is obtained for different crack orientations and composite layers. Employing the integral transform method stress field caused by a screw dislocation in the substrate is determined. The dislocation solution is used to construct an integral equation for the density of dislocations on the crack surface. The numerical solution to integral equations is utilized to obtain stress intensity factors at the crack tip inside the substrate, crack opening displacements, and contours of the second invariant of stress deviator around the crack tip, situated at or close to the interface, for different crack orientations and orthotropic layers.
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各向同性半面与完整正交各向异性层粘结界面处裂纹的反平面分析
完成了裂纹各向同性半平面与完整正交各向异性层完美结合的分析。裂纹尖端在维持反平面牵引力的同时终止于或邻近于正交异性层和基材的界面。得到了不同裂纹取向和复合材料层在界面处裂纹尖端的应力奇异幂。采用积分变换法确定了基底中螺旋位错引起的应力场。用位错解构造了裂纹表面位错密度的积分方程。利用积分方程的数值解,得到了不同裂纹取向和正交异性层在衬底内裂纹尖端处的应力强度因子、裂纹张开位移以及裂纹尖端处或靠近界面处的应力偏差第二不变量的轮廓。
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来源期刊
Journal of Strain Analysis for Engineering Design
Journal of Strain Analysis for Engineering Design 工程技术-材料科学:表征与测试
CiteScore
3.50
自引率
6.20%
发文量
25
审稿时长
>12 weeks
期刊介绍: The Journal of Strain Analysis for Engineering Design provides a forum for work relating to the measurement and analysis of strain that is appropriate to engineering design and practice. "Since launching in 1965, The Journal of Strain Analysis has been a collegiate effort, dedicated to providing exemplary service to our authors. We welcome contributions related to analytical, experimental, and numerical techniques for the analysis and/or measurement of stress and/or strain, or studies of relevant material properties and failure modes. Our international Editorial Board contains experts in all of these fields and is keen to encourage papers on novel techniques and innovative applications." Professor Eann Patterson - University of Liverpool, UK This journal is a member of the Committee on Publication Ethics (COPE).
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