Ka-band stacked and pseudo-differential orthogonal load-modulated balanced power amplifier in 22 nm CMOS FDSOI

IF 1.4 4区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC International Journal of Microwave and Wireless Technologies Pub Date : 2023-10-11 DOI:10.1017/s1759078723001137
Jere Rusanen, Alok Sethi, Nuutti Tervo, Veeti Kiuru, Timo Rahkonen, Aarno Pärssinen, Janne P. Aikio
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Abstract

Abstract This paper presents an integrated power amplifier (PA) following the orthogonal load-modulated balanced amplifier (OLMBA) topology. The fixed-phase prototype in this paper is implemented with 22 nm complementary metal oxide semiconductor (CMOS) fully depleted silicon-on-insulator (FDSOI) process. The proposed PA operates at 26 GHz frequency range, where it achieves 19.5 dBm output power, 16.6 dB gain, 15.7% power added efficiency, and 18.3 dBm output 1-dB compression point ( $P_{\rm 1\,dB}$ ). The PA is also tested with high dynamic range modulated signals, and it achieves, respectively, 11.4 dBm and 4.9 dBm average output power ( P avg ) with 100 MHz and 400 MHz 64-QAM third-generation partnership project/new radio frequency range 2 signals, and 14 dBm P avg with 0.6 Gb/s (120 MHz) single carrier 64-QAM signal, measured at 26 GHz and using −28 dBc adjacent channel leakage ratio and −21.9 dB (8%) error vector magnitude as threshold values. The proposed OLMBA is also compared to a stand-alone quadrature-balanced PA. Modulated measurements show that the stand-alone quadrature-balanced PA has better linearity in deep back-off, but the OLMBA has better efficiency.
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22 nm CMOS FDSOI的ka波段叠置和伪差分正交负载调制平衡功率放大器
摘要本文提出了一种基于正交负载调制平衡放大器拓扑结构的集成功率放大器(PA)。本文采用22 nm互补金属氧化物半导体(CMOS)全耗尽绝缘体上硅(FDSOI)工艺实现了固定相原型。该放大器工作于26 GHz频率范围,输出功率为19.5 dBm,增益为16.6 dB,功率增益为15.7%,输出1-dB压缩点为18.3 dBm ($P_{\rm 1\,dB}$)。该放大器还在高动态范围调制信号下进行了测试,在100 MHz和400 MHz 64-QAM第三代合作伙伴项目/新射频范围2信号下分别实现了11.4 dBm和4.9 dBm的平均输出功率(P avg),在26 GHz下以- 28 dBc相邻信道泄漏比和- 21.9 dB(8%)误差矢量幅度为阈值测量的0.6 Gb/s (120 MHz)单载波64-QAM信号下分别实现了14 dBm P avg。所提出的OLMBA也与独立的正交平衡PA进行了比较。调制测量结果表明,独立正交平衡放大器在深度退退时具有更好的线性度,而OLMBA具有更好的效率。
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来源期刊
International Journal of Microwave and Wireless Technologies
International Journal of Microwave and Wireless Technologies ENGINEERING, ELECTRICAL & ELECTRONIC-TELECOMMUNICATIONS
CiteScore
3.50
自引率
7.10%
发文量
130
审稿时长
6-12 weeks
期刊介绍: The prime objective of the International Journal of Microwave and Wireless Technologies is to enhance the communication between microwave engineers throughout the world. It is therefore interdisciplinary and application oriented, providing a platform for the microwave industry. Coverage includes: applied electromagnetic field theory (antennas, transmission lines and waveguides), components (passive structures and semiconductor device technologies), analogue and mixed-signal circuits, systems, optical-microwave interactions, electromagnetic compatibility, industrial applications, biological effects and medical applications.
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