Compact size antenna for skin implantable medical devices

IF 1.3 4区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC International Journal of Microwave and Wireless Technologies Pub Date : 2023-11-30 DOI:10.1017/s175907872300137x
Doondi Kumar Janapala, Nesasudha Moses, Jebasingh Bhagavathsingh
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Abstract

This research work presents an implantable antenna that operates at 5.8 GHz. By using a radiator with a loop-based design, the antenna can be made smaller. Radiator is made up of three connected rectangular loops. On the substrate’s back side, an I-shaped ground plane is used. As substrate and superstrate, polydimethylsiloxane (PDMS) with dimensions of 7 mm × 5 mm × 0.3 mm is used. The conducting sections are made using copper foil that is 30 µm thick. The suggested antenna is examined by the implantable medical device using realistic human scalp phantom models and a homogenous skin box. Simulated study revealed that it operates around 5.8 GHz with a bandwidth from 5.69 to 5.92 GHz. The specific absorption rate was 0.28 and 0.26 W/kg for skin box and human scalp phantoms, respectively, at 1 mW input power across 1 g volume tissue.
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用于皮肤植入式医疗设备的小型天线
本研究提出了一种工作频率为5.8 GHz的植入式天线。通过使用环路设计的散热器,天线可以做得更小。散热器由三个相连的矩形回路组成。在基板背面,使用i形接平面。衬底和上覆层采用尺寸为7 mm × 5 mm × 0.3 mm的聚二甲基硅氧烷(PDMS)。导线部分采用厚为30µm的铜箔制作。所建议的天线是由植入式医疗设备使用真实的人体头皮幻影模型和一个均匀的皮肤盒。仿真研究表明,它工作在5.8 GHz左右,带宽在5.69 ~ 5.92 GHz之间。在1mw的输入功率下,皮肤盒和人体头皮的比吸收率分别为0.28和0.26 W/kg。
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来源期刊
International Journal of Microwave and Wireless Technologies
International Journal of Microwave and Wireless Technologies ENGINEERING, ELECTRICAL & ELECTRONIC-TELECOMMUNICATIONS
CiteScore
3.50
自引率
7.10%
发文量
130
审稿时长
6-12 weeks
期刊介绍: The prime objective of the International Journal of Microwave and Wireless Technologies is to enhance the communication between microwave engineers throughout the world. It is therefore interdisciplinary and application oriented, providing a platform for the microwave industry. Coverage includes: applied electromagnetic field theory (antennas, transmission lines and waveguides), components (passive structures and semiconductor device technologies), analogue and mixed-signal circuits, systems, optical-microwave interactions, electromagnetic compatibility, industrial applications, biological effects and medical applications.
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