Copper micromesh-based lightweight transparent conductor with short response time for wearable heaters

IF 4.7 Q2 NANOSCIENCE & NANOTECHNOLOGY Micro and Nano Systems Letters Pub Date : 2021-10-25 DOI:10.1186/s40486-021-00132-5
Kim, Han-Jung, Kim, Yoonkap
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Abstract

Thickness-controlled transparent conducting films (TCFs) were fabricated by transfer printing a 100 nm thick Cu micromesh structure onto poly(vinyl alcohol) (PVA) substrates of different thicknesses (~ 50, ~ 80, and ~ 120 μm) to develop a lightweight transparent wearable heater with short response time. The Cu mesh-based TCF fabricated on a ~ 50 µm thick PVA substrate exhibited excellent optical and electrical properties with a light transmittance of 86.7% at 550 nm, sheet resistance of ~ 10.8 Ω/sq, and figure-of-merit of approximately 236, which are comparable to commercial indium tin oxide film-based transparent conductors. The remarkable flexibility of the Cu mesh-based TCF was demonstrated through cyclic mechanical bending tests. In addition, the Cu mesh-based TCF with ~ 50 μm thick PVA substrate demonstrated a fast Joule heating performance with a thermal response time of ~ 18.0 s and a ramping rate of ~ 3.0 ℃/s under a driving voltage of 2.5 V. Lastly, the reliable response and recovery characteristics of the Cu mesh/PVA film-based transparent heater were confirmed through the cyclic power test. We believe that the results of this study is useful in the development of flexible transparent heaters, including lightweight deicing/defogging films, wearable sensors/actuators, and medical thermotherapy pads.
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用于可穿戴式加热器的基于铜微网的轻质透明导体,响应时间短
通过在不同厚度(~ 50、~ 80和~ 120 μm)的聚乙烯醇(PVA)衬底上转移打印厚度为100 nm的Cu微网结构,制备了厚度可控的透明导电薄膜(tcf),开发了响应时间短的轻质透明可穿戴加热器。在~ 50µm厚的PVA衬底上制备的Cu网基TCF具有优异的光学和电学性能,在550 nm处透光率为86.7%,片电阻为~ 10.8 Ω/sq,品质因数约为236,与商业氧化铟锡薄膜透明导体相当。通过循环力学弯曲试验证明了铜网格基TCF具有显著的柔韧性。此外,在2.5 V驱动电压下,采用~ 50 μm厚PVA衬底的Cu网格TCF具有快速焦耳加热性能,热响应时间为~ 18.0 s,升温速率为~ 3.0℃/s。最后,通过循环功率试验,验证了Cu网/PVA薄膜透明加热器的可靠响应和恢复特性。我们相信这项研究的结果对柔性透明加热器的开发是有用的,包括轻质除冰/除雾薄膜、可穿戴传感器/致动器和医用热疗垫。
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来源期刊
Micro and Nano Systems Letters
Micro and Nano Systems Letters Engineering-Biomedical Engineering
CiteScore
10.60
自引率
5.60%
发文量
16
审稿时长
13 weeks
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