Influence of the soldering paste type on optical and thermal parameters of LED modules

Abstract

Purpose

This paper presents the results of the investigations of LED modules soldered with the use of different soldering pastes.

Design/methodology/approach

The tested power LED modules are soldered using different solder pastes and soldering processes. Thermal parameters of the performed modules are tested using indirect electrical methods. The results of measurements obtained for different modules are compared and discussed.

Findings

It was shown that the soldering process visibly influences the results of measurements of optical and thermal parameters of LED modules. For example, values of thermal resistance of these modules and the efficiency of conversion of electrical energy into light differ between each other even by 15%.

Practical implications

The obtained results of investigations can be usable for designers of the assembly process of power LED modules.

Originality/value

This paper shows the investigations results in the area of effective assembly of power LEDs to the metal core printed circuit board (MCPCB) using different soldering pastes (REL22, REL61, LMPA-Q6, OM-5100, OM-338-PT, M8, OM-340, CVP-390). It was shown that the best thermal and optical properties of these modules are obtained for the OM5100 paste by Alpha Assembly.