Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2024-08-28 DOI:10.1108/ssmt-05-2023-0021

Zhang Liang

{"title":"Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating","authors":"Zhang Liang","doi":"10.1108/ssmt-05-2023-0021","DOIUrl":null,"url":null,"abstract":"<h3>Purpose</h3>\n<p>The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.</p>\n<h3>Design/methodology/approach</h3>\n<p>This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).</p>\n<h3>Findings</h3>\n<p>The results show clearly that the formation of nano-Cu<sub>6</sub>Sn<sub>5</sub> films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu<sub>6</sub>Sn<sub>5</sub> films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu<sub>6</sub>Sn<sub>5</sub> films in Sn solder joints due to its adsorption.</p>\n<h3>Originality/value</h3>\n<p>The formation of nano-Cu<sub>6</sub>Sn<sub>5</sub> films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.</p>","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":"27 1","pages":""},"PeriodicalIF":1.7000,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Soldering & Surface Mount Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1108/ssmt-05-2023-0021","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

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Abstract

Purpose

The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.

Design/methodology/approach

This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).

Findings

The results show clearly that the formation of nano-Cu₆Sn₅ films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu₆Sn₅ films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu₆Sn₅ films in Sn solder joints due to its adsorption.

Originality/value

The formation of nano-Cu₆Sn₅ films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.

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利用激光加热在锡/铜和锡-0.1AlN/铜结构中形成 Cu6Sn5 薄膜及其生长机制

目的本研究的目的是在使用激光作为热源形成焊点时，纳米级金属间化合物（IMC）的形成和生长。结果表明，在激光加热（200 W 和 2 s）Sn/Cu 和 Sn-0.1AlN/Cu 系统时，可以形成纳米-Cu6Sn5 薄膜。Sn-0.1AlN 的纳米-Cu6Sn5 薄膜厚度为 500 nm，晶粒直径为 700 nm，一般平行于铜表面。随着激光加热时间和激光功率的延长，锡/铜和锡-0.1AlN/铜焊点的 IMC 薄膜厚度都从 524.2 纳米逐渐增加到 2025.8 纳米。然而，由于 AlN 纳米粒子的吸附作用，掺杂 AlN 纳米粒子会减缓锡焊点中 Cu6Sn5 薄膜的生长速度。原创性/价值利用激光加热形成纳米 Cu6Sn5 薄膜可为纳米薄膜的开发提供一种新方法，从而实现电子封装中的冶金互连。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.