Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2024-08-06 DOI:10.1108/ssmt-08-2023-0053

Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng Li

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Abstract

Purpose

This paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer thickness and microstructure of the soldering interface was observed and analyzed at different soldering temperatures and times.

Design/methodology/approach

Sn-0.7Cu-xNi solder alloy was prepared by a high-frequency induction melting furnace. Then Sn-0.7Cu-xNi alloy was soldered on a Cu substrate at different soldering temperatures and times.

Findings

It was found that Ni made the intermetallic compounds in the Sn-0.7Cu solder alloy gradually aggregate and coarsen, and the microstructure was refined. The phase compositions of the solder alloy are mainly composed of the ß-Sn phase and a few intermetallic compounds, Cu₆Sn₅ + (Cu, Ni)₆Sn₅. The maximum value of 12.1 HV is reached when the Ni content is 0.1 Wt.%. When the Ni content is 0.5 Wt.%, the wettability of the solder alloy increases by about 15%, the interface thickness increases by about 8.9% and the scallop-like structure is the most refined. When the soldering time is 10 min and the soldering temperature is 280 °C, the wettability of Sn-0.7Cu-0.2Ni is the best.

Originality/value

It is groundbreaking to combine the change in soldering interface with the soldering industry. The effects of different soldering temperatures and times on the Sn-0.7Cu-xNi alloy were studied. Under the same conditions, Sn-0.7Cu-0.2Ni exhibits better wettability and more stable solder joint stability.

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添加镍对 Sn-0.7Cu-xNi 焊料合金润湿性和界面微观结构的影响

目的本文旨在研究不同镍含量对 Sn-0.7Cu 合金微观结构和性能的影响。采用高频感应熔炼炉制备了 Sn-0.7Cu-xNi 焊料合金。结果发现，镍使 Sn-0.7Cu 焊料合金中的金属间化合物逐渐聚集并变粗，微观结构得到细化。焊料合金的相组成主要由 ß-Sn 相和少量金属间化合物组成，即 Cu6Sn5 + (Cu，Ni)6Sn5。当镍含量为 0.1 Wt.% 时，最大值为 12.1 HV。当镍含量为 0.5 Wt.%时，焊料合金的润湿性增加了约 15%，界面厚度增加了约 8.9%，扇贝状结构最为精细。当焊接时间为 10 分钟、焊接温度为 280 ℃ 时，Sn-0.7Cu-0.2Ni 的润湿性最好。研究了不同焊接温度和时间对 Sn-0.7Cu-xNi 合金的影响。在相同条件下，Sn-0.7Cu-0.2Ni 表现出更好的润湿性和更稳定的焊点稳定性。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.