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Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating 利用激光加热在锡/铜和锡-0.1AlN/铜结构中形成 Cu6Sn5 薄膜及其生长机制
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-28 DOI: 10.1108/ssmt-05-2023-0021
Zhang Liang

Purpose

The purpose of this study is the formation and growth of nanoscale intermetallic compounds (IMCs) when laser is used as a heat source to form solder joints.

Design/methodology/approach

This study investigates the Sn/Cu and Sn-0.1AlN/Cu structure using laser soldering under different laser power: (200, 225 and 250 W) and heating time: (2, 3 and 4 s).

Findings

The results show clearly that the formation of nano-Cu6Sn5 films is feasible in the laser heating (200 W and 2 s) with Sn/Cu and Sn-0.1AlN/Cu system. The nano-Cu6Sn5 films with thickness of 500 nm and grains with 700 nm are generally parallel to the Cu surface with Sn-0.1AlN. Both IMC films thickness of Sn/Cu and Sn-0.1AlN/Cu solder joints gradually increased from 524.2 to 2025.8 nm as the laser heating time and the laser power extended. Nevertheless, doping AlN nanoparticles can slow down the growth rate of Cu6Sn5 films in Sn solder joints due to its adsorption.

Originality/value

The formation of nano-Cu6Sn5 films using laser heating can provide a new method for nanofilm development to realize the metallurgical interconnection in electronic packaging.

目的本研究的目的是在使用激光作为热源形成焊点时,纳米级金属间化合物(IMC)的形成和生长。结果表明,在激光加热(200 W 和 2 s)Sn/Cu 和 Sn-0.1AlN/Cu 系统时,可以形成纳米-Cu6Sn5 薄膜。Sn-0.1AlN 的纳米-Cu6Sn5 薄膜厚度为 500 nm,晶粒直径为 700 nm,一般平行于铜表面。随着激光加热时间和激光功率的延长,锡/铜和锡-0.1AlN/铜焊点的 IMC 薄膜厚度都从 524.2 纳米逐渐增加到 2025.8 纳米。然而,由于 AlN 纳米粒子的吸附作用,掺杂 AlN 纳米粒子会减缓锡焊点中 Cu6Sn5 薄膜的生长速度。 原创性/价值利用激光加热形成纳米 Cu6Sn5 薄膜可为纳米薄膜的开发提供一种新方法,从而实现电子封装中的冶金互连。
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引用次数: 0
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films 退火温度对 C-Ni 薄膜三维表面立体分析的影响
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-27 DOI: 10.1108/ssmt-08-2023-0043
Vali Dalouji, Nasim Rahimi

Purpose

The purpose of this paper is to study the correlation between the thicknesses of the C–Ni films that have been prepared by RF-magnetron sputtering on quartz substrates and their three-dimensional (3D) micro morphology. In this work by AFM images, this paper studied stereo metric analysis of these films.

Design/methodology/approach

The C–Ni films have been prepared by RF-magnetron sputtering on quartz substrates using a mosaic target consisting of pure graphite and strips of pure nickel approximately 2 cm2 attached to the graphite race track. The field emission scanning electronic microscopy (FESEM) images were used for the morphological characterization.

Findings

The histogram peaks are zero for all samples and the histograms are almost symmetric around zero. Temperature did not have much effect on the degree of isolation, so all four diagrams have similar results. The qualitative observations through statistical parameters of the 3D surface texture revealed that the smoothest surface has been obtained for C-Ni films annealed at 500 °C (Sa, Sq, Sz and Sv have the lower values), while the most irregular topography has been found for C-Ni films annealed at 300 °C (the fractal dimension D = 2.01 ± 0.131).

Originality/value

As shown in FESEM images, the size of the particles was increased for films deposited from 300 ºC to 800ºC; however, at 1000ºC, it decreased significantly. The histogram peaks are zero for all samples and the histograms were almost symmetric around zero. Also, the largest and lowest root mean heights (Sq) belong to films at 300 °C and 500 °C. Furthermore, the more irregular surface was found at 300 °C, and the more regular surface was found at 500 °C. As the temperature was increased to 800 °C, the values of the IAPSD function increased systematically, and then the values of the IAPSD function was decreased in the fourth sample. The surface skewness of samples annealed at 1000 °C was positive which confirms the lack of dominance of cavities on their surface with the highest amount of C-Ni films at 800 °C.

目的本文旨在研究在石英基底上通过射频-磁控溅射制备的 C-Ni 薄膜的厚度与其三维(3D)微观形态之间的相关性。在这项工作中,本文通过原子力显微镜图像研究了这些薄膜的立体度量分析。设计/方法/途径在石英基底上使用射频磁控溅射法制备了 C-Ni 薄膜,使用的镶嵌靶由纯石墨和附着在石墨赛道上的约 2 平方厘米的纯镍条组成。所有样品的直方图峰值均为零,且直方图在零点附近几乎对称。温度对隔离度的影响不大,因此四张图的结果相似。通过对三维表面纹理统计参数的定性观察发现,在 500 °C 下退火的 C-Ni 薄膜表面最光滑(Sa、Sq、Sz 和 Sv 的值较低),而在 300 °C 下退火的 C-Ni 薄膜的地形最不规则(分形维数 D = 2.01 ± 0.131)。原创性/价值 如 FESEM 图像所示,从 300ºC 到 800ºC 沉积的薄膜的颗粒尺寸增大;但在 1000ºC 时,颗粒尺寸显著减小。所有样品的直方图峰值均为零,且直方图在零点附近几乎对称。此外,最大和最小的平均根高(Sq)分别属于 300 °C 和 500 °C 的薄膜。此外,300 °C 时的表面更不规则,而 500 °C 时的表面更规则。当温度升高到 800 ℃ 时,IAPSD 函数的值逐渐增大,然后在第四个样品中 IAPSD 函数的值逐渐减小。在 1000 ℃ 下退火的样品的表面偏斜度为正值,这证实了在 800 ℃ 下 C-Ni 膜含量最高的样品表面缺乏空穴。
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引用次数: 0
Effect of different beam distances in laser soldering process: a numerical and experimental study 激光焊接过程中不同光束距离的影响:数值和实验研究
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-22 DOI: 10.1108/ssmt-11-2023-0065
Muhammad Zaim Hanif Nazarudin, Mohamad Aizat Abas, Wan Maryam Wan Ahmad Kamil, Faiz Farhan Ahmad Nadzri, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani, Mohd Hafiz Zawawi

Purpose

This paper aims to investigate the effect of different beam distance by understanding laser beam influence on solder joint quality. The utilisation numerical-based simulations and experimental validation will help to minimise the formation of micro void in PTH that can lead to cracks and defects on passive devices.

Design/methodology/approach

The research uses a combination approach of numerical-based simulation using Finite Volume Method (FVM) and experimental validation to explore the impact of different laser beam distances on solder joint quality in PTH assemblies. The study visualises solder flow and identifies the optimal beam distance for placing a soldering workpiece and a suitable tolerance distance for inserting the solder wire.

Findings

The simulation results show the formation of micro void that occurs in PTH region with low volume fraction and unbalance heat concentration profile observed. The experimental results indicate that the focus point of the laser beam at a 99.0 mm distance yields the smallest beam size. Simulation visualisation demonstrates that the laser beam’s converging area at +4.6 mm from the focus point which provides optimal tolerance distances for placing the solder wire. The high-power laser diode exhibits maximum tolerance distance at 103.6 mm from the focus point where suitable beam distance for positioning of the soldering workpiece with 50% laser power. The simulation results align with the IPC-A-610 standard, ensuring optimal filling height, fillet shape with a 90° contact angle and defect-free.

Practical implications

This research provides implications for the industry by demonstrating the capability of the simulation approach to produce high-quality solder joints. The parameters, such as beam distance and power levels, offer practical guidelines for improving laser soldering processes in the manufacturing industry.

Originality/value

This study contributes to the field by combining high-power laser diode technology with numerical-based simulations to optimise the beam distance parameters for minimising micro void formation in the PTH region.

目的 本文旨在通过了解激光束对焊点质量的影响,研究不同光束距离的效果。利用基于数值的模拟和实验验证,将有助于最大限度地减少 PTH 中可能导致无源器件出现裂纹和缺陷的微小空隙的形成。 设计/方法/途径 该研究采用基于数值的有限体积法(FVM)模拟和实验验证相结合的方法,探索不同激光束距离对 PTH 组装中焊点质量的影响。研究对焊料流动进行了可视化,并确定了放置焊接工件的最佳光束距离以及插入焊锡丝的合适公差距离。实验结果表明,99.0 毫米距离处的激光束聚焦点产生的光束尺寸最小。模拟可视化结果表明,激光束的汇聚区位于离聚焦点 +4.6 毫米处,这为放置焊锡丝提供了最佳公差距离。高功率激光二极管在距离聚焦点 103.6 毫米处显示出最大公差距离,该处适合使用 50%的激光功率来定位焊接工件。模拟结果符合 IPC-A-610 标准,确保了最佳填充高度、接触角为 90° 的圆角形状和无缺陷。光束距离和功率水平等参数为改进制造业的激光焊接工艺提供了实用指南。原创性/价值这项研究将高功率激光二极管技术与基于数值的模拟相结合,优化了光束距离参数,从而最大限度地减少了 PTH 区域的微空洞形成,为该领域做出了贡献。
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引用次数: 0
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate 铜基板上锡-3Ag-3Sb-xIn 焊料的界面 IMC 生长行为
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-13 DOI: 10.1108/ssmt-03-2024-0013
Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun He

Purpose

The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.

Design/methodology/approach

In this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.

Findings

When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu3Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu3Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.

Originality/value

The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu3Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.

目的 焊点的可靠性与无铅焊料和基底界面之间金属间化合物(IMC)层的生长密切相关。本文旨在研究不同铟含量的锡-3Ag-3Sb-xIn/Cu(x = 0、1、2、3、4、5 Wt.%)焊点和商用锡-3Ag-0.5Cu/Cu 焊点在 125°C 等温老化过程中界面 IMC 层的生长行为。本文制备了锡-3Ag-3Sb-xIn/Cu(x = 0、1、2、3、4、5 Wt.%)和商用锡-3Ag-0.5Cu/Cu 焊料,用于接合铜基板。然后对这些样品进行 0、2、8、14、25 和 45 天的等温老化。研究结果当锡-3Ag-3Sb-xIn/铜焊点中的 In 浓度超过 2 Wt.%时,会产生大量的 InSb 颗粒。这些颗粒起到了扩散屏障的作用,阻碍了界面上 IMC 层的生长。老化过程中 Cu3Sn 层的生长与 In 的存在密切相关。当 In 的浓度超过 3 Wt.% 时,Cu3Sn 层的生长速度明显降低。这些颗粒限制了整个 IMC 层的生长,而较高的 In 含量也会减缓 Cu3Sn 层的生长。这项研究对于设计新型高可靠性焊料的合金成分具有重要意义。
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引用次数: 0
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy 添加镍对 Sn-0.7Cu-xNi 焊料合金润湿性和界面微观结构的影响
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-06 DOI: 10.1108/ssmt-08-2023-0053
Jinshuai Xie, Lei Tang, Pengfei Gao, Zhengquan Zhang, Liangfeng Li

Purpose

This paper aims to study the effect of different Ni content on the microstructure and properties of Sn-0.7Cu alloy. Then, the spreading area, wetting angle, interface layer thickness and microstructure of the soldering interface was observed and analyzed at different soldering temperatures and times.

Design/methodology/approach

Sn-0.7Cu-xNi solder alloy was prepared by a high-frequency induction melting furnace. Then Sn-0.7Cu-xNi alloy was soldered on a Cu substrate at different soldering temperatures and times.

Findings

It was found that Ni made the intermetallic compounds in the Sn-0.7Cu solder alloy gradually aggregate and coarsen, and the microstructure was refined. The phase compositions of the solder alloy are mainly composed of the ß-Sn phase and a few intermetallic compounds, Cu6Sn5 + (Cu, Ni)6Sn5. The maximum value of 12.1 HV is reached when the Ni content is 0.1 Wt.%. When the Ni content is 0.5 Wt.%, the wettability of the solder alloy increases by about 15%, the interface thickness increases by about 8.9% and the scallop-like structure is the most refined. When the soldering time is 10 min and the soldering temperature is 280 °C, the wettability of Sn-0.7Cu-0.2Ni is the best.

Originality/value

It is groundbreaking to combine the change in soldering interface with the soldering industry. The effects of different soldering temperatures and times on the Sn-0.7Cu-xNi alloy were studied. Under the same conditions, Sn-0.7Cu-0.2Ni exhibits better wettability and more stable solder joint stability.

目的 本文旨在研究不同镍含量对 Sn-0.7Cu 合金微观结构和性能的影响。采用高频感应熔炼炉制备了 Sn-0.7Cu-xNi 焊料合金。结果发现,镍使 Sn-0.7Cu 焊料合金中的金属间化合物逐渐聚集并变粗,微观结构得到细化。焊料合金的相组成主要由 ß-Sn 相和少量金属间化合物组成,即 Cu6Sn5 + (Cu,Ni)6Sn5。当镍含量为 0.1 Wt.% 时,最大值为 12.1 HV。当镍含量为 0.5 Wt.%时,焊料合金的润湿性增加了约 15%,界面厚度增加了约 8.9%,扇贝状结构最为精细。当焊接时间为 10 分钟、焊接温度为 280 ℃ 时,Sn-0.7Cu-0.2Ni 的润湿性最好。研究了不同焊接温度和时间对 Sn-0.7Cu-xNi 合金的影响。在相同条件下,Sn-0.7Cu-0.2Ni 表现出更好的润湿性和更稳定的焊点稳定性。
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引用次数: 0
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping 通过助焊剂掺杂添加钴的无铅 Sn-58Bi 焊料合金的机械性能研究
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-31 DOI: 10.1108/ssmt-02-2024-0007
Lina Syazwana Kamaruzzaman, Yingxin Goh, Yi Chung Goh

Purpose

This study aims to investigate the effect of incorporating cobalt (Co) into Sn-58Bi alloy on its phase composition, tensile properties, hardness and thermal aging performances. The fracture morphologies of tensile-tested solders are also investigated to correlate the microstructural changes with tensile properties of the solder alloys. Then, the thermal aging performances of the solder alloys are investigated in terms of their intermetallic compound (IMC) layer morphology and thickness.

Design/methodology/approach

The Sn-58Bi and Sn-58Bi-xCo, where x = 1.0, 1.5 and 2.0 Wt.%, were prepared using the flux doping technique. X-ray diffraction (XRD) is used to study the phase composition of the solder alloys, whereas scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) are used to investigate the microstructure, fractography and compositions of the solders. Tensile properties such as ultimate tensile strength (UTS), Young’s modulus and elongation are tested using the tensile test, whereas the microhardness value is gained from the micro-Vickers hardness test. The morphology and thickness of the IMC layer at the solder’s joints are investigated by varying the thermally aging duration up to 56 days at 80°C.

Findings

XRD analysis shows the presence of Co3Sn2 phase and confirms that Co was successfully incorporated via the flux doping technique. The microstructure of all Sn-58Bi-xCo solders did not differ significantly from Sn-58Bi solders. Sn-58Bi-2.0Co solder exhibited optimum properties among all compositions, with the highest UTS (87.89 ± 2.55 MPa) at 0.01 s−1 strain rate and the lowest IMC layer thickness at the interface after being thermally aged for 56 days (3.84 ± 0.67 µm).

Originality/value

The originality and value of this research lie in its novel exploration of the flux doping technique to introduce minor alloying of Co into Sn-58Bi solder alloys, providing new insights into enhancing the properties and performance of these solders. This new Sn-Bi-Co alloy has the potential to replace lead-containing solder alloy in low-temperature soldering.

目的 本研究旨在探讨在 Sn-58Bi 合金中加入钴(Co)对其相组成、拉伸性能、硬度和热老化性能的影响。此外,还研究了拉伸测试焊料的断口形态,以便将微观结构变化与焊料合金的拉伸性能联系起来。然后,从金属间化合物 (IMC) 层形态和厚度的角度研究了焊料合金的热老化性能。设计/方法/途径使用助焊剂掺杂技术制备了 Sn-58Bi 和 Sn-58Bi-xCo,其中 x = 1.0、1.5 和 2.0 Wt.%。X 射线衍射(XRD)用于研究焊料合金的相组成,而扫描电子显微镜(SEM)和能量色散 X 射线光谱(EDX)则用于研究焊料的微观结构、断口和组成。拉伸性能,如极限拉伸强度 (UTS)、杨氏模量和伸长率是通过拉伸试验测试的,而显微硬度值则是通过显微维氏硬度试验获得的。研究结果XRD 分析表明存在 Co3Sn2 相,并证实通过助焊剂掺杂技术成功掺入了钴。所有 Sn-58Bi-xCo 焊料的微观结构与 Sn-58Bi 焊料没有明显差异。在所有成分中,Sn-58Bi-2.0Co 焊料表现出最佳性能,在 0.01 s-1 应变速率下 UTS 最高(87.89 ± 2.55 MPa),热老化 56 天后界面 IMC 层厚度最低(3.84 ± 0.67 µm)。这种新型锡-铋-钴合金有望在低温焊接中取代含铅焊料合金。
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引用次数: 0
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints 焊接温度和成分对 Sn58Bi-xSAC0307/ENIG 焊点微观结构和剪切特性的影响
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-25 DOI: 10.1108/ssmt-03-2024-0014
Mengxia Jiang, Yang Liu, Yuxiong Xue, Guangbao Shan, Jun Lv, Mairui Huang

Purpose

This paper aims to systematically study the effects of reflow temperature and SAC0307 (SAC) content on the micromorphology and mechanical properties of Sn58Bi-xSAC0307 composite solder joints to meet the requirements of high integration and low-temperature packaging of devices and provide references for the application of composite solder joints.

Design/methodology/approach

Sn58Bi and SAC0307 solder paste was mechanically mixed in different proportions to prepare Sn58Bi-xSAC0307/ENIG solder joints. The thermal properties, microstructure and mechanical properties of the composite solder joints were studied.

Findings

As SAC content in the solder increases, the balling temperature of SnBi-SAC solder gradually increases. The addition of SAC alloy reduces the grain size of large Bi-rich phase, and there are small-sized dispersed Bi and Ag3Sn particles in the bulk solder. The intermetallic compounds composition of the SnBi-xSAC/ENIG solder joint changes from Ni3Sn4 to (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 with SAC increasing. As the soldering temperature increases, the strength of all solder joints shows a rising trend. Among them, the shear strength of SnBi-20SAC solder joints at a reflow temperature of 150°C is approximately 37 MPa. As the reflow temperature increases to 250°C, the shear strength of solder joints increases to approximately 67 MPa.

Originality/value

This study provides a reference for the optimization of low-temperature solder composition and soldering process under different package designs.

目的 本文旨在系统研究回流焊温度和 SAC0307(SAC)含量对 Sn58Bi-xSAC0307 复合焊点微观形貌和力学性能的影响,以满足器件高集成度和低温封装的要求,为复合焊点的应用提供参考。研究结果随着焊料中 SAC 含量的增加,SnBi-SAC 焊料的球化温度逐渐升高。SAC 合金的加入减小了大的富铋相的晶粒尺寸,在块状焊料中出现了小尺寸的分散铋和 Ag3Sn 颗粒。随着 SAC 的增加,SnBi-xSAC/ENIG 焊点的金属间化合物成分从 Ni3Sn4 变为(Ni,Cu)3Sn4 和(Cu,Ni)6Sn5。随着焊接温度的升高,所有焊点的强度都呈上升趋势。其中,在回流温度为 150°C 时,SnBi-20SAC 焊点的剪切强度约为 37 兆帕。随着回流焊温度升高到 250°C,焊点的剪切强度增加到约 67 MPa。原创性/价值这项研究为优化不同封装设计下的低温焊料成分和焊接工艺提供了参考。
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引用次数: 0
Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components Sn99Ag0.3Cu0.7-TiO2 复合焊点及其对功率元件热参数的影响
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-09 DOI: 10.1108/ssmt-03-2024-0016
Adrian Pietruszka, Paweł Górecki, Agata Skwarek

Purpose

This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint.

Design/methodology/approach

Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven.

Findings

Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2.

Research limitations/implications

Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly.

Practical implications

Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous q

目的 本文旨在研究复合焊点制备方法对金属氧化物半导体场效应晶体管(MOSFET)热性能和焊点机械强度的影响。参考合金为 Sn99Ag0.3Cu0.7。增强焊点的二氧化钛重量百分比从 0.125 到 1.0 Wt.%不等。测试使用了两种元件。0805 封装的电阻器用于机械强度测试,元件焊接在 FR4 基板上。在热参数测量中,使用了 TO-263 封装的功率元件 MOSFET,并将其焊接到金属芯印刷电路板(PCB)基板上。结果剪切测试表明,添加氧化钛不会显著提高焊点的抗机械损伤能力。在批量烘箱中焊接时,与参考样品相比,氧化钛的添加不会对焊点的机械强度产生重大影响。MOSFET 的热阻 Rthj-a 取决于复合焊点中的二氧化钛浓度,当二氧化钛的重量百分比为 0.25 时,热阻 Rthj 达到最小值:TiO2 增强对机械强度的影响微乎其微,这表明液相温度和微观结构发生了变化,需要进一步研究。热性能:热参数随 TiO2 浓度而变化,0.25 Wt.% 时性能最佳。实验验证对实际应用至关重要。实验确认:最佳浓度的验证对于准确评估和实际应用至关重要。焊接方法的影响:批量烘箱焊接可能会影响机械强度,因此有必要探索其他方法。热性能与机械性能的增强:虽然二氧化钛并不能显著增强机械强度,但却能改善热性能,这突出说明了在功率半导体组装中进行平衡设计的必要性。必须通过实验确定平衡热性能和机械强度的最佳浓度。批量烘箱焊接可能会影响机械强度,因此需要评估替代技术。二氧化钛复合焊点有望在功率电子器件中实现高效散热。微结构分析可优化焊点设计和性能。焊接过程中严格的质量控制可确保稳定的热性能,并减轻对机械强度的负面影响。然而,它对机械强度的影响有限,可能会影响产品的可靠性。要了解这些影响,就需要研究人员和行业利益相关者通力合作,共同开发稳健的焊接技术。通过实验验证确保最佳的 TiO2 浓度对于保持产品完整性和安全标准至关重要。此外,传播研究成果和最佳实践可以使制造商做出明智的决策,促进电子制造工艺的创新和可持续发展。最终,解决这些社会问题将促进技术进步,同时优先考虑消费者的信任和电子行业的产品质量。原创性/价值该研究表明了用于组装 MOSFET 器件的焊接技术的重要性。
{"title":"Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components","authors":"Adrian Pietruszka, Paweł Górecki, Agata Skwarek","doi":"10.1108/ssmt-03-2024-0016","DOIUrl":"https://doi.org/10.1108/ssmt-03-2024-0016","url":null,"abstract":"<h3>Purpose</h3>\u0000<p>This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint.</p><!--/ Abstract__block -->\u0000<h3>Design/methodology/approach</h3>\u0000<p>Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO<sub>2</sub>) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO<sub>2</sub>, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven.</p><!--/ Abstract__block -->\u0000<h3>Findings</h3>\u0000<p>Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance <em>R<sub>thj-a</sub></em> of MOSFETs depends on TiO<sub>2</sub> concentration in the composite solder joint reaching the minimum <em>R<sub>thj</sub></em> at 0.25 Wt.% of TiO<sub>2</sub>.</p><!--/ Abstract__block -->\u0000<h3>Research limitations/implications</h3>\u0000<p>Mechanical strength: TiO<sub>2</sub> reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO<sub>2</sub> concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO<sub>2</sub> does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly.</p><!--/ Abstract__block -->\u0000<h3>Practical implications</h3>\u0000<p>Incorporating TiO<sub>2</sub> enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO<sub>2</sub> composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous q","PeriodicalId":49499,"journal":{"name":"Soldering & Surface Mount Technology","volume":null,"pages":null},"PeriodicalIF":2.0,"publicationDate":"2024-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141569290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering 焊接温度和预热温度对波峰焊锡锌焊料合金性能的影响
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1108/ssmt-11-2023-0064
Songtao Qu, Qingyu Shi, Gong Zhang, Xinhua Dong, Xiaohua Xu

Purpose

This study aims to address the problem of low-temperature wave soldering in industry production with Sn-9Zn-2.5 Bi-1.5In alloys and develop qualified process parameters. Sn–Zn eutectic alloys are lead-free solders applied in consumer electronics due to their low melting point, high strength, and low cost. In the electronic assembly industry, Sn–Zn eutectic alloys have great potential for use.

Design/methodology/approach

This paper explored developing and implementing process parameters for low-temperature wave soldering of Sn–Zn alloys (SN-9ZN-2.5BI-1.5 In). A two-factor, three-level design of the experiments experiment was designed to simulate various conditions parameters encountered in Sn–Zn soldering, developed the nitrogen protection device of waving soldering and proposed the optimal process parameters to realize mass production of low-temperature wave soldering on Sn–Zn alloys.

Findings

The Sn-9Zn-2.5 Bi-1.5In alloy can overcome the Zn oxidation problem, achieve low-temperature wave soldering and meet IPC standards, but requires the development of nitrogen protection devices and the optimization of a series of process parameters. The design experiment reveals that preheating temperature, soldering temperature and flux affect failure phenomena. Finally, combined with the process test results, an effective method to support mass production.

Research limitations/implications

In term of overcome Zn’s oxidation characteristics, anti-oxidation wave welding device needs to be studied. Various process parameters need to be developed to achieve a welding process with lower temperature than that of lead solder(Sn–Pb) and lead-free SAC(Sn-0.3Ag-0.7Cu). The process window of Sn–Zn series alloy (Sn-9Zn-2.5 Bi-1.5In alloy) is narrow. A more stringent quality control chart is required to make mass production.

Practical implications

In this research, the soldering temperature of Sn-9Zn-2.5 Bi-1.5In is 5 °C and 25 °C lower than Sn–Pb and Sn-0.3Ag-0.7Cu(SAC0307). To the best of the authors’ knowledge, this work was the first time to apply Sn–Zn solder alloy under actual production conditions on wave soldering, which was of great significance for the study of wave soldering of the same kind of solder alloy.

Social implications

Low-temperature wave soldering can supported green manufacturing widely, offering a new path to achieve carbon emissions for many factories and also combat to international climate change.

Originality/value

There are many research papers on Sn–Zn alloys, but methods of achieving low-temperature wave soldering to meet IPC standards are infrequent. Especially the process control method that can be mass-produced is more challenging. In addition, the metal storage is very high a

目的 本研究旨在解决工业生产中使用 Sn-9Zn-2.5 Bi-1.5In 合金进行低温波峰焊的问题,并制定合格的工艺参数。Sn-Zn 共晶合金因其低熔点、高强度和低成本而成为消费类电子产品中的无铅焊料。本文探讨了 Sn-Zn 合金(SN-9ZN-2.5BI-1.5 In)低温波峰焊工艺参数的开发和实施。研究结果Sn-9Zn-2.5Bi-1.5In 合金能克服 Zn 氧化问题,实现低温波峰焊接并达到 IPC 标准,但需要开发氮气保护装置并优化一系列工艺参数。设计实验揭示了预热温度、焊接温度和助焊剂对失效现象的影响。最后,结合工艺试验结果,提出了支持批量生产的有效方法。研究局限/意义在克服 Zn 的氧化特性方面,需要研究抗氧化波峰焊装置。需要开发各种工艺参数,以实现比有铅焊料(锡铅)和无铅 SAC(锡-0.3Ag-0.7Cu)温度更低的焊接工艺。Sn-Zn 系列合金(Sn-9Zn-2.5 Bi-1.5In 合金)的工艺窗口较窄。实际意义在这项研究中,Sn-9Zn-2.5 Bi-1.5In 的焊接温度比 Sn-Pb 和 Sn-0.3Ag-0.7Cu(SAC0307) 低 5 ℃ 和 25 ℃。社会意义低温波峰焊可以广泛支持绿色制造,为许多工厂实现碳排放提供了新的途径,同时也可以应对国际气候变化。尤其是可大规模生产的过程控制方法更具挑战性。此外,金属储量很高,成本相对较低,这对提供企业竞争力有很大帮助,还能支持绿色制造的发展,对 Sn-Zn 系列更广泛的发展有很好的促进作用。
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引用次数: 0
Robust vision detection of pipeline solder joints 对管道焊点进行可靠的视觉检测
IF 2 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-03 DOI: 10.1108/ssmt-04-2023-0018
Huijun An, Lingbao Kong

Purpose

Solder joint inspection plays a critical role in various industries, with a focus on integrated chip (IC) solder joints and metal surface welds. However, the detection of tubular solder joints has received relatively less attention. This paper aims to address the challenges of detecting small targets and complex environments by proposing a robust visual detection method for pipeline solder joints. The method is characterized by its simplicity, cost-effectiveness and ease of implementation.

Design/methodology/approach

A robust visual detection method based on the characteristics of pipeline solder joints is proposed. With the improved hue, saturation and value (HSV) color space, the method uses a multi-level template matching approach to first segment the pipeline from the background, and then match the endpoint of the pipeline to accurately locate the solder joint. The proposed method leverages the distinctive characteristics of pipeline solder joints and employs an enhanced HSV color space. A multi-level template matching approach is utilized to segment the pipeline from the background and accurately locate the solder joint by matching the pipeline endpoint.

Findings

The experimental results demonstrate the effectiveness of the proposed solder joint detection method in practical detection tasks. The average precision of pipeline weld joint localization exceeds 95%, while the average recall is greater than 90%. These findings highlight the applicability of the method to pipeline solder joint detection tasks, specifically in the context of production lines for refrigeration equipment.

Research limitations/implications

The precision of the method is influenced by the placement angle and lighting conditions of the test specimen, which may pose challenges and impact the algorithm's performance. Potential avenues for improvement include exploring deep learning methods, incorporating additional features and contextual information for localization, and utilizing advanced image enhancement techniques to improve image quality.

Originality/value

The proposed pipeline solder joint detection method offers a novel and practical approach. The simplicity, cost-effectiveness and ease of implementation make it an attractive choice for detecting pipeline solder joints in different industrial applications.

目的焊点检测在各行各业都发挥着至关重要的作用,重点是集成芯片(IC)焊点和金属表面焊缝。然而,管状焊点的检测却相对较少受到关注。本文旨在通过提出一种稳健的管状焊点视觉检测方法来应对检测小型目标和复杂环境的挑战。设计/方法/途径根据管道焊点的特点,提出了一种稳健的视觉检测方法。利用改进的色调、饱和度和值(HSV)色彩空间,该方法采用多级模板匹配方法,首先从背景中分割出流水线,然后匹配流水线的端点,以准确定位焊点。所提出的方法利用了流水线焊点的显著特征,并采用了增强的 HSV 色彩空间。实验结果表明了所提出的焊点检测方法在实际检测任务中的有效性。管道焊点定位的平均精确度超过 95%,平均召回率超过 90%。研究局限/启示该方法的精确度受测试样本的放置角度和照明条件的影响,这可能会带来挑战并影响算法的性能。潜在的改进途径包括探索深度学习方法、为定位整合附加特征和上下文信息,以及利用先进的图像增强技术提高图像质量。该方法简单、成本效益高且易于实施,是在不同工业应用中检测管道焊点的极具吸引力的选择。
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引用次数: 0
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Soldering & Surface Mount Technology
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