Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2023-11-27 DOI:10.1108/ssmt-12-2022-0061

Meng Jiang, Yang Liu, Ke Li, Zhen Pan, Quan Sun, Yongzhe Xu, Yuan Tao

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Abstract

Purpose

The purpose of this paper is to study the reliability of sintered nano-silver joints on bare copper substrates during high-temperature storage (HTS).

Design/methodology/approach

In this study, HTS at 250 °C was carried out to investigate the reliability of nano-silver sintered joints. Combining the evolution of the microstructure and shear strength of the joints, the degradation mechanisms of joints performance were characterized.

Findings

The results indicated that the degradation of the shear properties of sintered nano-silver joints on copper substrates was attributed to copper oxidation at the silver/copper interface and interdiffusion of interfacial elements. The joints decreased by approximately 57.4% compared to the original joints after aging for 500 h. In addition, severe coarsening of the silver structure was also an important cause for joints failure during HTS.

Originality/value

This paper provides a comparison of quantitative and mechanistic evaluation of sintered silver joints on bare copper substrates during HTS, which is of great importance in promoting the development of sintered silver technology.

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裸铜衬底烧结纳米银接头高温贮存过程中的显微组织和力学演化

目的研究裸铜衬底烧结纳米银接头在高温储存过程中的可靠性。设计/方法/方法在本研究中，采用250°C高温超导(HTS)来研究纳米银烧结接头的可靠性。结合节理的微观结构演变和抗剪强度，分析了节理性能的退化机理。结果表明:铜基体上烧结纳米银接头剪切性能的下降主要是由于铜在银/铜界面上的氧化和界面元素的相互扩散。时效500h后，接头与原接头相比减少了约57.4%。此外，银组织的严重粗化也是高温超导过程中接头失效的重要原因。本文对裸铜衬底烧结银接头进行了定量评价和机理评价的比较，对促进烧结银技术的发展具有重要意义。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.