Fully solution-processed n-i-p type perovskite solar cells with efficiency over 19% enabled by a hydrophobic PEDOT:F interlayer and silver nanowire top electrode
Zhenhua Zhao, Yang Liu, Changzeng Ding, Wusong Zha, Qun Luo, Yinhua Zhou, Chang‐Qi Ma
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引用次数: 0
Abstract
Solution-processed top electrode is the key technology for the realization of fully solution-processed perovskite solar cells (PSCs). In this paper, we reported the preparation of fully-solution processed n-i-p type PSCs with spray-coated silver nanowires (AgNWs) top electrode. Experiment results demonstrated that low power conversion efficiency (PCE) of 16.00% with a low fill factor of 67.41% was obtained for the reference cell, when the AgNWs is directly coated on the 2,2′,7,7′-tetrakis(N,N-di-p-methoxyphenylamine)-9,9′-spirobifluorene (Spiro-OMeTAD) layer. This result indicates a charge extraction barrier at the Spiro-OMeTAD/AgNWs interface, which could be attributed to the poor compatibility between Spiro-OMeTAD and AgNWs layers. By inserting a thin layer of poly(3,4-ethylenedioxythiophene):perfluorinated sulfonic acid ionomers (PEDOT:F), a modified PEDOT with lower surface energy, the interface connection between Spiro-OMeTAD/PEDOT:F and AgNWs was improved, leading to an enhanced PCE of up to 19.11%. In addition, the PEDOT:F-based cells retained 64% of the initial PCE after operating at the maximum power point for 1800 hours, whereas the reference cells retained only 30% of the initial PCE. The current work proved that PEDOT:F/AgNWs could be an excellent option for fully-solution processed n-i-p type PSCs.
期刊介绍:
Flexible and Printed Electronics is a multidisciplinary journal publishing cutting edge research articles on electronics that can be either flexible, plastic, stretchable, conformable or printed. Research related to electronic materials, manufacturing techniques, components or systems which meets any one (or more) of the above criteria is suitable for publication in the journal. Subjects included in the journal range from flexible materials and printing techniques, design or modelling of electrical systems and components, advanced fabrication methods and bioelectronics, to the properties of devices and end user applications.