A new characterization model of FinFET self-heating effect based on FinFET characteristic parameter

IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronic Engineering Pub Date : 2024-02-08 DOI:10.1016/j.mee.2024.112155
Yue Wang, Huaguo Liang, Hong Zhang, Danqing Li, Yingchun Lu, Maoxiang Yi, Zhengfeng Huang
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Abstract

The characterization of the self-heating effect (SHE) has been an important research topic in advanced technology, but the existing characterizations are few and the characterization process is relatively complex. In this research, a SHE characterization model is established based on the relationship between output transconductance variation (gm), gate source voltage (VGS) and temperature variation (T) caused by SHE through machine learning, and then the model is validated by theoretical analyses and experimental simulation. The characterization model is capable of directly calculating the T caused by SHE during I - V testing and simplifying the SHE characterization steps while ensuring characterization accuracy (T difference < 1 °C), thus saving costs. It is also found that the model can expand the characterization range (VGS: 0.3–0.7 V) of SHE and conducts quantitative characterization with model calculation under different VGS, realizing a high characterization resolution of VGS: 0.01 V. The circuit level application proves that the method can be effectively applied to the characterization of the SHE and solves the problem of the characterization of the circuit level SHE.

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基于 FinFET 特征参数的 FinFET 自热效应新表征模型
自热效应(SHE)的表征一直是先进技术领域的重要研究课题,但现有的表征方法较少,表征过程也相对复杂。本研究通过机器学习,根据 SHE 引起的输出跨导变化(Δgm)、栅源电压(VGS)和温度变化(ΔT)之间的关系建立了 SHE 表征模型,然后通过理论分析和实验仿真对模型进行了验证。该表征模型能够直接计算 I - V 测试期间由 SHE 引起的 ∆T 值,简化了 SHE 表征步骤,同时确保了表征精度(∆T 值相差 < 1 °C),从而节约了成本。研究还发现,该模型可以扩展 SHE 的表征范围(VGS:0.3-0.7 V),并在不同 VGS 下通过模型计算进行定量表征,实现了 VGS. 0.01 V 的高表征分辨率:电路级应用证明该方法可有效应用于 SHE 的表征,解决了电路级 SHE 表征的难题。
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来源期刊
Microelectronic Engineering
Microelectronic Engineering 工程技术-工程:电子与电气
CiteScore
5.30
自引率
4.30%
发文量
131
审稿时长
29 days
期刊介绍: Microelectronic Engineering is the premier nanoprocessing, and nanotechnology journal focusing on fabrication of electronic, photonic, bioelectronic, electromechanic and fluidic devices and systems, and their applications in the broad areas of electronics, photonics, energy, life sciences, and environment. It covers also the expanding interdisciplinary field of "more than Moore" and "beyond Moore" integrated nanoelectronics / photonics and micro-/nano-/bio-systems. Through its unique mixture of peer-reviewed articles, reviews, accelerated publications, short and Technical notes, and the latest research news on key developments, Microelectronic Engineering provides comprehensive coverage of this exciting, interdisciplinary and dynamic new field for researchers in academia and professionals in industry.
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