Ameni Ragoubi, Guillaume Ducloud, Alban Agazzi, Patrick Dewailly, Ronan Le Goff
{"title":"Modeling the Thermoforming Process of a Complex Geometry Based on a Thermo-Visco-Hyperelastic Model","authors":"Ameni Ragoubi, Guillaume Ducloud, Alban Agazzi, Patrick Dewailly, Ronan Le Goff","doi":"10.3390/jmmp8010033","DOIUrl":null,"url":null,"abstract":"The thermoforming process is commonly used in industry for the manufacturing of lightweight, thin-walled products from a pre-extruded polymer sheet. Many simulations have been developed to simulate the process and optimize it with computer tools. The development of testing machines has simplified the simulation of this type of process, allowing researchers to characterize the behavior of the material at different temperatures and for large deformation to be closer to the real conditions of the process. This paper presents the results of a study on the modeling of the thermoforming process for an industrial demonstrator made from a high-impact polystyrene (HIPS) polymer. The HIPS shows a mechanical behavior that depends on the temperature and strain rate. In such conditions, a thermo-hyper-viscoelastic constitutive model is used to replicate the thermoforming process of the industrial demonstrator using ABAQUS/Explicit. Its behavior is determined via various experimental tests: uniaxial tensile tests at different temperatures and strain rates and Dynamic Mechanical Analysis (DMA). A comparison between the numerical and experimental results is carried out for the evolution of film thickness. The paper concludes with a discussion of possible improvements to be considered for future simulations of the thermoforming process using Abaqus, which presents complex challenges in terms of contact and material modeling.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"68 11","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-02-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8010033","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The thermoforming process is commonly used in industry for the manufacturing of lightweight, thin-walled products from a pre-extruded polymer sheet. Many simulations have been developed to simulate the process and optimize it with computer tools. The development of testing machines has simplified the simulation of this type of process, allowing researchers to characterize the behavior of the material at different temperatures and for large deformation to be closer to the real conditions of the process. This paper presents the results of a study on the modeling of the thermoforming process for an industrial demonstrator made from a high-impact polystyrene (HIPS) polymer. The HIPS shows a mechanical behavior that depends on the temperature and strain rate. In such conditions, a thermo-hyper-viscoelastic constitutive model is used to replicate the thermoforming process of the industrial demonstrator using ABAQUS/Explicit. Its behavior is determined via various experimental tests: uniaxial tensile tests at different temperatures and strain rates and Dynamic Mechanical Analysis (DMA). A comparison between the numerical and experimental results is carried out for the evolution of film thickness. The paper concludes with a discussion of possible improvements to be considered for future simulations of the thermoforming process using Abaqus, which presents complex challenges in terms of contact and material modeling.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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