J. Friedlein, M. Böhnke, Malte Schlichter, M. Bobbert, Gerson Meschut, J. Mergheim, Paul Steinmann
{"title":"Material Parameter Identification for a Stress-State-Dependent Ductile Damage and Failure Model Applied to Clinch Joining","authors":"J. Friedlein, M. Böhnke, Malte Schlichter, M. Bobbert, Gerson Meschut, J. Mergheim, Paul Steinmann","doi":"10.3390/jmmp8040157","DOIUrl":null,"url":null,"abstract":"Similar to bulk metal forming, clinch joining is characterised by large plastic deformations and a variety of different 3D stress states, including severe compression. However, inherent to plastic forming is the nucleation and growth of defects, whose detrimental effects on the material behaviour can be described by continuum damage models and eventually lead to material failure. As the damage evolution strongly depends on the stress state, a stress-state-dependent model is utilised to correctly track the accumulation. To formulate and parameterise this model, besides classical experiments, so-called modified punch tests are also integrated herein to enhance the calibration of the failure model by capturing a larger range of stress states and metal-forming-specific loading conditions. Moreover, when highly ductile materials are considered, such as the dual-phase steel HCT590X and the aluminium alloy EN AW-6014 T4 investigated here, strong necking and localisation might occur prior to fracture. This can alter the stress state and affect the actual strain at failure. This influence is captured by coupling plasticity and damage to incorporate the damage-induced softening effect. Its relative importance is shown by conducting inverse parameter identifications to determine damage and failure parameters for both mentioned ductile metals based on up to 12 different experiments.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"52 12","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8040157","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Similar to bulk metal forming, clinch joining is characterised by large plastic deformations and a variety of different 3D stress states, including severe compression. However, inherent to plastic forming is the nucleation and growth of defects, whose detrimental effects on the material behaviour can be described by continuum damage models and eventually lead to material failure. As the damage evolution strongly depends on the stress state, a stress-state-dependent model is utilised to correctly track the accumulation. To formulate and parameterise this model, besides classical experiments, so-called modified punch tests are also integrated herein to enhance the calibration of the failure model by capturing a larger range of stress states and metal-forming-specific loading conditions. Moreover, when highly ductile materials are considered, such as the dual-phase steel HCT590X and the aluminium alloy EN AW-6014 T4 investigated here, strong necking and localisation might occur prior to fracture. This can alter the stress state and affect the actual strain at failure. This influence is captured by coupling plasticity and damage to incorporate the damage-induced softening effect. Its relative importance is shown by conducting inverse parameter identifications to determine damage and failure parameters for both mentioned ductile metals based on up to 12 different experiments.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
Scopus
CAS
INSPEC
Portico