In Situ Stereo Digital Image Correlation with Thermal Imaging as a Process Monitoring Method in Vacuum-Assisted Thermoforming

IF 4.7 3区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-03-01 DOI:10.3390/jmmp8020049
Rasoul Varedi, B. Buffel, F. Desplentere
{"title":"In Situ Stereo Digital Image Correlation with Thermal Imaging as a Process Monitoring Method in Vacuum-Assisted Thermoforming","authors":"Rasoul Varedi, B. Buffel, F. Desplentere","doi":"10.3390/jmmp8020049","DOIUrl":null,"url":null,"abstract":"This experimental study probes the dynamic behaviour of a 3 mm ABS sheet during positive mould vacuum-assisted thermoforming. In this process, the sheet undergoes large and fast deformations caused by the applied vacuum and mechanical stretching by the mould. The objective is to elucidate the complexities of these large, rapid, and non-isothermal deformations. The non-isothermal conditions are caused by the radiative heating of the sheet, convective heat loss to the surrounding air, and conductive heat transfer from the sheet to the mould. By utilizing stereo digital image correlation (DIC) in tandem with thermal imaging, the present study accurately maps the occurring displacement, strain, and strain rate field in relation to real-time temperature variation in the material. The study progresses to observe the ABS material from the moment it contacts the mould until it conforms to a positive 250 mm diameter semi-sphere cast aluminum mould. The DIC methods are validated by comparing thickness values derived from DIC’s principal strain directions to ultrasonic thickness gauge readings. This knowledge not only broadens the understanding of the thermo-mechanical behaviour of the material but also aids in optimizing process parameters for improved thickness uniformity in thermoformed products.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"09 4","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8020049","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

This experimental study probes the dynamic behaviour of a 3 mm ABS sheet during positive mould vacuum-assisted thermoforming. In this process, the sheet undergoes large and fast deformations caused by the applied vacuum and mechanical stretching by the mould. The objective is to elucidate the complexities of these large, rapid, and non-isothermal deformations. The non-isothermal conditions are caused by the radiative heating of the sheet, convective heat loss to the surrounding air, and conductive heat transfer from the sheet to the mould. By utilizing stereo digital image correlation (DIC) in tandem with thermal imaging, the present study accurately maps the occurring displacement, strain, and strain rate field in relation to real-time temperature variation in the material. The study progresses to observe the ABS material from the moment it contacts the mould until it conforms to a positive 250 mm diameter semi-sphere cast aluminum mould. The DIC methods are validated by comparing thickness values derived from DIC’s principal strain directions to ultrasonic thickness gauge readings. This knowledge not only broadens the understanding of the thermo-mechanical behaviour of the material but also aids in optimizing process parameters for improved thickness uniformity in thermoformed products.
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将原位立体数字图像与热成像相关联,作为真空辅助热成型的过程监控方法
本实验研究探究了 3 毫米 ABS 板材在正模真空辅助热成型过程中的动态特性。在此过程中,板材会因施加的真空和模具的机械拉伸而发生巨大而快速的变形。研究的目的是阐明这些巨大、快速和非等温变形的复杂性。非等温条件是由板材的辐射加热、向周围空气的对流热损失以及从板材到模具的传导热传递造成的。本研究利用立体数字图像相关性(DIC)与热成像技术相结合,准确绘制出与材料实时温度变化相关的位移、应变和应变率场。研究将继续观察 ABS 材料从接触模具到与直径为 250 毫米的正半球形铸铝模具相吻合的整个过程。通过比较从 DIC 主应变方向得出的厚度值和超声波测厚仪读数,验证了 DIC 方法。这些知识不仅拓宽了对材料热机械行为的理解,还有助于优化工艺参数,提高热成型产品的厚度均匀性。
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来源期刊
CiteScore
7.20
自引率
4.30%
发文量
567
期刊介绍: ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/​Abstracted: Web of Science SCIE Scopus CAS INSPEC Portico
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