{"title":"In Situ Stereo Digital Image Correlation with Thermal Imaging as a Process Monitoring Method in Vacuum-Assisted Thermoforming","authors":"Rasoul Varedi, B. Buffel, F. Desplentere","doi":"10.3390/jmmp8020049","DOIUrl":null,"url":null,"abstract":"This experimental study probes the dynamic behaviour of a 3 mm ABS sheet during positive mould vacuum-assisted thermoforming. In this process, the sheet undergoes large and fast deformations caused by the applied vacuum and mechanical stretching by the mould. The objective is to elucidate the complexities of these large, rapid, and non-isothermal deformations. The non-isothermal conditions are caused by the radiative heating of the sheet, convective heat loss to the surrounding air, and conductive heat transfer from the sheet to the mould. By utilizing stereo digital image correlation (DIC) in tandem with thermal imaging, the present study accurately maps the occurring displacement, strain, and strain rate field in relation to real-time temperature variation in the material. The study progresses to observe the ABS material from the moment it contacts the mould until it conforms to a positive 250 mm diameter semi-sphere cast aluminum mould. The DIC methods are validated by comparing thickness values derived from DIC’s principal strain directions to ultrasonic thickness gauge readings. This knowledge not only broadens the understanding of the thermo-mechanical behaviour of the material but also aids in optimizing process parameters for improved thickness uniformity in thermoformed products.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"09 4","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8020049","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This experimental study probes the dynamic behaviour of a 3 mm ABS sheet during positive mould vacuum-assisted thermoforming. In this process, the sheet undergoes large and fast deformations caused by the applied vacuum and mechanical stretching by the mould. The objective is to elucidate the complexities of these large, rapid, and non-isothermal deformations. The non-isothermal conditions are caused by the radiative heating of the sheet, convective heat loss to the surrounding air, and conductive heat transfer from the sheet to the mould. By utilizing stereo digital image correlation (DIC) in tandem with thermal imaging, the present study accurately maps the occurring displacement, strain, and strain rate field in relation to real-time temperature variation in the material. The study progresses to observe the ABS material from the moment it contacts the mould until it conforms to a positive 250 mm diameter semi-sphere cast aluminum mould. The DIC methods are validated by comparing thickness values derived from DIC’s principal strain directions to ultrasonic thickness gauge readings. This knowledge not only broadens the understanding of the thermo-mechanical behaviour of the material but also aids in optimizing process parameters for improved thickness uniformity in thermoformed products.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
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