Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2024-04-12 DOI:10.1108/ssmt-12-2023-0076
Yanwei Dai, Libo Zhao, Fei Qin, Si Chen
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Abstract

Purpose

This study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.

Design/methodology/approach

Through microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.

Findings

The porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25°C/min, 15°C/min, to 5°C/min, respectively. The particle size appears more frequently within 1 µm and 2 µm under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.

Practical implications

The mechanical properties of sintered nano-silver under different sintering processes are clearly understood.

Originality/value

This paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.

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不同烧结参数下烧结纳米银的弹塑性纳米压痕行为
本研究旨在通过纳米压痕测试表征不同烧结工艺下烧结纳米银的力学性能。设计/方法/途径通过微观结构观察和表征,提出烧结工艺对烧结纳米银微观结构演变的影响。并利用纳米压痕试验测量了不同烧结工艺下烧结银的压痕载荷、压痕位移曲线。结果孔隙率随烧结温度的升高而减小,而烧结纳米银的平均粒径随烧结温度和烧结时间的增加而增大。此外,当升温速率从 25°C/min, 15°C/min 降至 5°C/min 时,孔隙率分别从 34.88%, 30.52% 降至 25.04%。在较低的升温速率下,粒度更多出现在 1 µm 和 2 µm 之间。反向分析发现,应变硬化指数随温度升高而逐渐增大,屈服应力值则随温度升高而显著减小。本文为理解烧结工艺对烧结纳米银力学性能的影响提供了一个新的视角。
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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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