The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Soldering & Surface Mount Technology Pub Date : 2024-04-17 DOI:10.1108/ssmt-02-2024-0006

Bingyi Li, Songtao Qu, Gong Zhang

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Abstract

Purpose

This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

Design/methodology/approach

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Findings

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

Originality/value

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

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用于 SMT 工艺的 Sn-9Zn-2.5Bi-1.5In 焊膏的制备和润湿性以及高剪切球性能

目的本研究旨在关注锡-9Zn-2.5Bi-1.5In 焊料的表面贴装技术（SMT）批量生产过程。本研究通过比较不同回流焊曲线参数下焊点的微观结构，评估焊膏的特性并选择更合适的回流焊参数。研究结果在含氧量为 3,000 ppm 的氮气环境中进行的焊膏润湿性和焊球测试符合工业生产的要求。焊膏的印刷性能良好，印刷速度可达 100-160 mm/s。使用传统的阶梯式回流焊接曲线进行焊接时，焊点表面会产生气泡，焊点中会出现许多空隙和缺陷。线性回流焊接曲线缩短了焊膏熔点以下的停留时间（约 110 秒）。这缩短了锌被氧化的时间，从而减少了焊点缺陷。使用优化的回流焊参数焊接的锡锌焊点的接合强度接近于 Sn-58Bi 和 SAC305，接合强度高。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.