Keita Marumoto, A. Fujinaga, Takeshi Takahashi, Hikaru Yamamoto, Motomichi Yamamoto
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引用次数: 0
Abstract
This study presents a new gas metal arc welding (GMAW) technique that achieves both high efficiency and low heat input using a hybridization of the hot-wire method. The optimal combination of welding speed and welding current conditions was investigated using a fixed hot-wire feeding speed of 10 m/min on a butt joint with a V-shaped groove using 19 mm thick steel plates. Molten pool stability and defect formation were observed using high-speed imaging and cross-sectional observations. The power consumption and heat input were predicted prior to welding and measured in the experiments. The results indicate that a combination of a welding current of 350–500 A and welding speed of 0.3–0.7 m/min is optimal to avoid defect formation and molten metal precedence using three or four passes. The higher efficiency and lower heat input achieved by hot-wire GMAW results in a weld metal of adequate hardness, narrower heat-affected zone, smaller grain size at the fusion boundary, and lower power consumption than those obtained using tandem GMAW and high-current GMAW. Based on the experimental results, a single bevel groove, which is widely used in construction machinery welding joints, was welded using hot-wire GMAW, and we confirmed that the welding part could be welded in six passes, whereas eight passes were required with GMAW only.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
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