Evidence for reversible oxygen ion movement during electrical pulsing: enabler of the emerging ferroelectricity in binary oxides

Huan Liu, Fei Yu, Bing Chen, Zhengdong Luo, Jiajia Chen, Yong Zhang, Ze Feng, Hong Dong, Xiao Yu, Yan Liu, Genquan Han, Yue Hao
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Abstract

Ferroelectric HfO2-based materials and devices show promising potential for advancing emerging information technology but face challenges with inadequate electrostatic control, degraded reliability, and serious variation for EOT (effective oxide thickness) scaling. We demonstrate a novel interface-type switching strategy to realize ferroelectric characteristics in atomic-scale amorphous binary oxide films, which are formed in oxygen-deficient conditions by atomic layer deposition (ALD) at low temperatures. This approach can avoid the shortcomings of reliability degradation and gate leakage increment in scaling poly-crystalline doped HfO2-based films. Through theoretical modeling and experimental characterization, we show that: 1) Emerging ferroelectricity exists in the ultrathin oxide system due to microscopic ion migration in the switching process. 2) These ferroelectric binary oxide films are governed by the interface-limited switching mechanism, which can be attributed to the oxygen vacancy migration and the surface defect related to electron (de)trapping. 3) Transistors featuring ultrathin amorphous dielectrics, used for nonvolatile memory applications with an operating voltage reduced to ±1 V, have also been experimentally demonstrated. These findings suggest that the strategy is a promising approach to realizing the next-generation CMOS with scalable ferroelectric material.
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电脉冲期间氧离子可逆运动的证据:二元氧化物中新出现的铁电性的促成因素
基于 HfO2 的铁电材料和器件在推动新兴信息技术的发展方面展现出巨大潜力,但也面临着静电控制不足、可靠性降低以及 EOT(有效氧化物厚度)缩放变化严重等挑战。我们展示了一种新颖的界面型开关策略,可在原子尺度的非晶二元氧化物薄膜中实现铁电特性,这种薄膜是在低温缺氧条件下通过原子层沉积(ALD)形成的。这种方法可以避免多晶掺杂 HfO2 基薄膜在扩展过程中出现的可靠性下降和栅极漏电增量等缺点。通过理论建模和实验表征,我们证明了以下几点1) 开关过程中的微观离子迁移导致超薄氧化物体系中存在新兴铁电性。2) 这些铁电二元氧化物薄膜受限于界面开关机制,这可归因于氧空位迁移和与电子(去)捕获有关的表面缺陷。3) 实验还证明了具有超薄非晶电介质的晶体管,可用于工作电压降至 ±1 V 的非易失性存储器应用。这些研究结果表明,该策略是实现采用可扩展铁电材料的下一代 CMOS 的一种可行方法。
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