Sara Nasiri, Mohammad Reza Khosravani, Tamara Reinicke, Jivka Ovtcharova
{"title":"Digital Twin Modeling for Smart Injection Molding","authors":"Sara Nasiri, Mohammad Reza Khosravani, Tamara Reinicke, Jivka Ovtcharova","doi":"10.3390/jmmp8030102","DOIUrl":null,"url":null,"abstract":"In traditional injection molding, each level of the process has its own monitoring and improvement initiatives. But in the upcoming industrial revolution, it is important to establish connections and communication among all stages, as changes in one stage might have an impact on others. To address this issue, digital twins (DTs) are introduced as virtual models that replicate the entire injection molding process. This paper focuses on the data and technology needed to build a DT model for injection molding. Each stage can have its own DT, which are integrated into a comprehensive model of the process. DTs enable the smart automation of production processes and data collection, reducing manual efforts in supervising and controlling production systems. However, implementing DTs is challenging and requires effort for conception and integration with the represented systems. To mitigate this, the current work presents a model for systematic knowledge-based engineering for the DTs of injection molding. This model includes fault detection systems, 3D printing, and system integration to automate development activities. Based on knowledge engineering, data analysis, and data mapping, the proposed DT model allows fault detection, prognostic maintenance, and predictive manufacturing.","PeriodicalId":3,"journal":{"name":"ACS Applied Electronic Materials","volume":"4 10","pages":""},"PeriodicalIF":4.7000,"publicationDate":"2024-05-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACS Applied Electronic Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.3390/jmmp8030102","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In traditional injection molding, each level of the process has its own monitoring and improvement initiatives. But in the upcoming industrial revolution, it is important to establish connections and communication among all stages, as changes in one stage might have an impact on others. To address this issue, digital twins (DTs) are introduced as virtual models that replicate the entire injection molding process. This paper focuses on the data and technology needed to build a DT model for injection molding. Each stage can have its own DT, which are integrated into a comprehensive model of the process. DTs enable the smart automation of production processes and data collection, reducing manual efforts in supervising and controlling production systems. However, implementing DTs is challenging and requires effort for conception and integration with the represented systems. To mitigate this, the current work presents a model for systematic knowledge-based engineering for the DTs of injection molding. This model includes fault detection systems, 3D printing, and system integration to automate development activities. Based on knowledge engineering, data analysis, and data mapping, the proposed DT model allows fault detection, prognostic maintenance, and predictive manufacturing.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
Indexed/Abstracted:
Web of Science SCIE
Scopus
CAS
INSPEC
Portico