Manipulating epoxy-polycarbonate sandwich films with enhanced dielectric performance via solution-immersion process

IF 2.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Letters Pub Date : 2024-06-30 DOI:10.1016/j.matlet.2024.136947
Yingxin Chen , Jiaming Luo , Mingsheng Li , Shiyang Yi , Yonghong Cheng , Lei Zhang
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Abstract

Epoxy-polycarbonate sandwiched films with enhanced dielectric performance were prepared in this study. Unlike traditional tedious multiple scratch-coating approach, the sandwich dielectric films were prepared based on a convenient solution-immersion process. Polycarbonate solutions with different concentration were applied to adjust the film composition and compared with epoxy-polycarbonate blending film. We found that rather than deteriorating the breakdown strength as shown in the blending counterpart, sandwiched films prepared by solution immersion shows superior breakdown strength (709.6 MV/m), almost 40 % better than both epoxy and polycarbonate components. Moreover, tan δ of the films prepared from solution-immersion (<0.005) is apparently smaller than blending samples (∼0.008). Both factors lead to admirable ideal dielectric energy storage performance (8.44 J/cm3) of the film, better than many conventional polymers.

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通过溶液浸泡工艺制作具有更强介电性能的环氧树脂-聚碳酸酯夹层薄膜
本研究制备了具有更强介电性能的环氧树脂-聚碳酸酯夹层薄膜。与传统的繁琐的多次刮涂方法不同,夹层介质薄膜的制备采用了便捷的溶液浸泡工艺。我们采用不同浓度的聚碳酸酯溶液来调整薄膜成分,并与环氧树脂-聚碳酸酯混合薄膜进行比较。我们发现,通过溶液浸泡法制备的夹层薄膜的击穿强度(709.6 MV/m)并没有像混合薄膜那样下降,反而比环氧树脂和聚碳酸酯成分的击穿强度高出近 40%。此外,溶液浸泡法制备的薄膜的 tan δ(<0.005)明显小于混合样品(∼0.008)。这两个因素导致薄膜具有令人钦佩的理想介电储能性能(8.44 J/cm3),优于许多传统聚合物。
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来源期刊
Materials Letters
Materials Letters 工程技术-材料科学:综合
CiteScore
5.60
自引率
3.30%
发文量
1948
审稿时长
50 days
期刊介绍: Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review. Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials. Contributions include, but are not limited to, a variety of topics such as: • Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors • Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart • Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction • Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots. • Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing. • Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic • Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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