3D wave dispersion analysis of graphene platelet-reinforced ultra-stiff double functionally graded nanocomposite sandwich plates with metamaterial honeycomb core layer

Abstract

This research addresses the three-dimensional thermomechanical wave propagation behavior in sandwich composite nanoplates with a metamaterial honeycomb core layer and double functionally graded (FG) ultra-stiff surface layers. Due to its potential for high-temperature applications, pure nickel (Ni) is preferred for the honeycomb core layer, and an Al₂O₃/Ni ceramic-metal matrix is preferred for the surface layers. The functional distribution of graphene platelets (GPLs) in three different patterns, Type-U, Type-X, and Type-O, in the metal-ceramic matrix with a power law distribution provides double-FG properties to the surface layers. The mechanical and thermal material characteristics of the core and surface layers, as well as the reinforcing GPLs, are temperature-dependent. The pattern of temperature variation over the plate thickness is considered to be nonlinear. The sandwich nanoplate’s motion equations are obtained by combining the sinusoidal higher-order shear deformation theory (SHSDT) with nonlocal integral elasticity and strain gradient elasticity theories. The wave equations are established by using Hamilton’s principle. Parametric simulations and graphical representations are performed to analyze the effects of honeycomb size variables, wave number, the power law index, the GPL distribution pattern, the GPL weight ratio, and the temperature rise on three-dimensional wave propagation in an ultra-stiff sandwich plate. The results of the analysis reveal that the 3D wave propagation of the sandwich nanoplate can be significantly modified or tuned depending on the desired parameters and conditions. Thus, the proposed sandwich structure is expected to provide essential contributions to radar/sonar stealth applications in air, space, and submarine vehicles in high or low-temperature environments, protection of microelectromechanical devices from high noise and vibration, soft robotics applications, and wearable health and protective equipment applications.