Microstructure quantification and phased array ultrasonic inspection of GH3535 alloy weld

Yuan Xiaodan, Yu Kun, Li Zhijun, Wang Jinlong, Zhang Yuan
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Abstract

The critical problem in accurately characterising the defects in nickel-based alloy weld is the skewing of the ultrasonic beam due to the heterogeneity. This article aims to address this problem by utilising microstructure analysis and mode techniques to account for the skewing of the ultrasonic beam and the formation of root signals in the weld. The macroscopic and microscopic metallography of the weld is quantitatively described, focusing on the GH3535 alloy weld. The mean grain size of the base metal and the weld are 60 and 400 μm, respectively. The local crystal orientation map of the weld is obtained using the electron backscatter diffraction technique, revealing a preferred orientation of the grains in the <100> direction. The propagation of the ultrasonic beam in GH3535 alloy weld was visualised by CIVA software. The beam's degree of skewing and splitting is related to the grain's angle of orientation difference. Phased array ultrasonic tests were conducted using a 64 L linear array probe with a centre frequency of 2.25 MHz to inspect the weld and side-drilled holes with a diameter of 3 mm. The echo signals from side-drilled holes in different depths were analysed in both the simulation and tests. The quantitative deviation of depth at the centre and lower end of the weld is 2.6% and 6%. The signal–noise ratio of the side-drilled holes in the weld in the test is 12.5–15.8 dB. The root signals were observed in the weld but not in the base metal. The forming mechanism of the root signal was elucidated by analysing the vertical orientation of the grains.
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GH3535 合金焊缝的微观结构量化和相控阵超声波检测
准确表征镍基合金焊缝缺陷的关键问题是异质性导致的超声波束偏斜。本文旨在利用微观结构分析和模式技术来解释超声波束的偏斜和焊缝中根信号的形成,从而解决这一问题。本文以 GH3535 合金焊缝为重点,对焊缝的宏观和微观金相进行了定量描述。母材和焊缝的平均晶粒尺寸分别为 60 和 400 μm。利用电子反向散射衍射技术获得了焊缝的局部晶体取向图,显示了晶粒在 <100>方向上的优先取向。CIVA 软件对 GH3535 合金焊缝中超声波束的传播进行了可视化处理。光束的偏斜和分裂程度与晶粒的取向角差异有关。使用中心频率为 2.25 MHz 的 64 L 线性阵列探头对焊缝和直径为 3 mm 的侧钻孔进行了相控阵超声波测试。模拟和测试均分析了不同深度侧钻孔的回波信号。焊缝中心和下端的深度定量偏差分别为 2.6% 和 6%。测试中焊缝侧钻孔的信噪比为 12.5-15.8 dB。在焊缝中观察到了根部信号,但在母材中没有观察到。通过分析晶粒的垂直取向,阐明了根信号的形成机制。
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来源期刊
CiteScore
3.80
自引率
16.70%
发文量
370
审稿时长
6 months
期刊介绍: The Journal of Process Mechanical Engineering publishes high-quality, peer-reviewed papers covering a broad area of mechanical engineering activities associated with the design and operation of process equipment.
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