Modeling and analysis of crosstalk induced effects in graphene-carbon nanotube composite interconnects

IF 2.7 Q2 PHYSICS, CONDENSED MATTER Micro and Nanostructures Pub Date : 2024-07-31 DOI:10.1016/j.micrna.2024.207946
Fa Zou, Zhongliang Pan
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Abstract

This paper proposes an equivalent circuit model for two-line coupled multilayer graphene nanoribbon - single-wall carbon nanotube (MLGNR-SWCNT) composite interconnects (MSCs), incorporating the effects of coupling capacitance and mutual inductance. We also examine the temperature-dependent crosstalk effect on the victim line of MSCs in the time domain using decoupling techniques and the ABCD parameter matrix approach. This analysis is conducted at the global level of 7 nm, 14 nm, and 22 nm technology nodes, comparing the performance of MSCs with MLGNR, SWCNT, and copper (Cu) interconnects, validated through HSPICE simulations. Our results reveal that the crosstalk delay of all interconnects induced by dynamic crosstalk exhibits superior performance in the in-phase crosstalk mode compared to the out-of-phase mode at room temperature. In particular, MSCs demonstrate less crosstalk delay in both crosstalk modes compared to SWCNT and Cu interconnects. In addition, we analyze the crosstalk delay of the victim line for two-line coupled MSCs at varying temperatures in out-of-phase crosstalk mode, comparing them with MLGNR, SWCNT, and Cu interconnects. Simulation results indicate that the crosstalk delay is temperature-dependent, increasing with rising temperatures, and the crosstalk delay of MSCs is the least of all interconnects. Furthermore, we investigate the crosstalk noise of MSCs induced by functional crosstalk at different temperatures, comparing it with MLGNR, SWCNT, and Cu interconnects. It is observed that the crosstalk noise peak remains constant with temperature changes across all interconnects; however, the holding time and width of crosstalk noise increases with rising temperatures and MSCs have the least crosstalk noise peak and crosstalk noise width of all interconnects. Also, numerical results exhibit that reducing interconnect temperature, SWCNT diameter, and edge roughness of MLGNR are effective strategies to diminish the crosstalk delay of MSCs. In addition, increasing line spacing is identified as an effective method to reduce crosstalk noise peak of MSCs of different lengths. The proposed model results show excellent agreement with HSPICE simulation data. Therefore, our analysis of crosstalk effect manifests that MLGNR-SWCNT composite can be a promising material to replace SWCNT and copper as an ideal material for global interconnect applications in thermally variable environments.

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石墨烯-碳纳米管复合互连中的串扰诱导效应建模与分析
本文提出了双线耦合多层石墨烯纳米带-单壁碳纳米管(MLGNR-SWCNT)复合互连器件(MSCs)的等效电路模型,其中包含耦合电容和互感的影响。我们还利用去耦技术和 ABCD 参数矩阵方法,在时域中研究了 MSC 受害线的温度相关串扰效应。这项分析是在 7 纳米、14 纳米和 22 纳米技术节点的全球层面上进行的,比较了 MSC 与 MLGNR、SWCNT 和铜(Cu)互连器件的性能,并通过 HSPICE 仿真进行了验证。我们的研究结果表明,在室温条件下,动态串扰引起的所有互连器件的串扰延迟在同相串扰模式下均表现出优于非同相串扰模式的性能。特别是,与 SWCNT 和铜互连器件相比,MSC 在两种串扰模式下的串扰延迟都较小。此外,我们还分析了双线耦合 MSC 在不同温度下的失相串扰模式中受害线的串扰延迟,并将其与 MLGNR、SWCNT 和铜互连器件进行了比较。仿真结果表明,串音延迟与温度有关,随着温度升高而增加,而 MSC 的串音延迟是所有互连器件中最小的。此外,我们还研究了 MSC 在不同温度下由功能串扰引起的串扰噪声,并将其与 MLGNR、SWCNT 和铜互连器件进行了比较。结果表明,所有互连器件的串扰噪声峰值随温度变化保持不变;但是,串扰噪声的保持时间和宽度随温度升高而增加,在所有互连器件中,MSC 的串扰噪声峰值和串扰噪声宽度最小。数值结果还表明,降低互连温度、SWCNT 直径和 MLGNR 边缘粗糙度是减少 MSC 串扰延迟的有效策略。此外,增加线间距也是降低不同长度 MSC 串扰噪声峰值的有效方法。提出的模型结果与 HSPICE 仿真数据显示出极好的一致性。因此,我们对串扰效应的分析表明,MLGNR-SWCNT 复合材料有望取代 SWCNT 和铜,成为热变化环境中全球互连应用的理想材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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